- Multi-layer PCB manufacturing process
- pattern plating
- tin plating
Pattern Plating | Multi-layer PCB Manufacturing Process - 08
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Sep 22,2022
In pattern plating process, the exposed copper surface is first thickened. Next, a layer of etching resist is deposited on parts of the board where the copper is to remain, while the unwanted copper is chemically etched away. After etching, the tin can be stripped off.
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