Via in Pad (VIP) is a technique that involves placing a via directly in the pad of a surface-mount component, instead of routing it to a nearby pad or via. This technology can be used to improve signal integrity, and thermal management, and reduce the size and cost of your PCB. In this video, we will introduce you to the basics of Via in Pad design, including what is a via-in-pad, the necessities of via-in-pad filling, as well as the design considerations you need to keep in mind when implementing VIP in your PCB.