Halides

Compounds containing fluorine, chlorine, bromine or iodine, which may be part of the activators in the flux system and must be cleaned.

Halides

H.D.I

High Density Interconnect.

H.D.I

Gull Wing Lead

A surface mounted device lead which flares outward from the device body. 

Gull Wing Lead

Guided Probe Method

A technique for volume production of PCBs based on incoming inspection to catch the majority of device failures and inspection prior to populating, that will eliminate most manufacturing errors. ...

Guided Probe Method

Ground Plane Clearance

Removed portions of a ground plane that serves to isolate it form a hole in the base material to which the plane is attached

Ground Plane Clearance

Ground Plane

A conductor layer, or portion of a conductor layer, used as a common reference point for circuit returns, shielding, or heat sinking. All those areas, not consumed by traces or pads, of the PCB which ...

Ground Plane

Grid

An orthogonal network of two sets of parallel, equidistant lines used for locating points on a printed circuit board.

Grid

Go/No-Go Test

Procedure to yield only pass or fail.

Go/No-Go Test

Glob Top

A coating process in which a set portion of resin is dispensed on the top of a chip or board. After spreading over the entire surface ,it is cured to form a soild protective coating.

Glob Top

Class Transition Temperature

TG-value, temperature at which resin ceases to act as a solid, Till this temperature, no separation will take place between resin/copper/reinforcement.

Class Transition Temperature

Glass Epoxy

A material used to fabricate printed circuit boards. The base material (fibre-glass) is impregnated with an epoxy filler which then must have copper laminated to its outer surface to form the material...

Glass Epoxy

GI

Laminate made from woven glass fibre material impregnated with polyimide resin.

GI

Gerber

Vector-based language, developed by Gerber Scientific Instrument Company, for sending commands to photoplotters.

Gerber

Gas Blanket

A flowing inert gas atmosphere used to keep metal from oxidizing.

Gas Blanket

Fused Coating

A metallic coating, usually tin or solder alluvia, which has been melted and solidified forming a metallurgical bond to the base material.

Fused Coating

Functional Test

To check an assembly using equipment that tests for the functions intended and engaging inputs and outputs.

Functional Test

Fully-Additive Process

An additive process wherein the entire thickness of electrically isolated conductors is built-up by copper.

Fully-Additive Process

FR4

Flame retardent laminate made from woven glass fibre material impregnated with epoxy resin.

FR4

Forced-air Convection

Convection, consisting of flow, rate, velocity and temperature, as heat transfer of fluid or gas over solder joints to be re-flowed.

Forced-air Convection

Footprint

(See also Land Pattern).A set of properly sized and placed pads of a PCB on which a surface mounted component can be placed and soldered. Alternatively, the footprint is the board area occupied by a s...

Footprint

1 ... 61 62 63 64 65 66 67 68 69 70 71 ...
Ranking Name Answers
1 PCBWay Team 6
2 Engineer 1
3 Stephen Newport 1
Back to top