Compounds containing fluorine, chlorine, bromine or iodine, which may be part of the activators in the flux system and must be cleaned.
A technique for volume production of PCBs based on incoming inspection to catch the majority of device failures and inspection prior to populating, that will eliminate most manufacturing errors. ...
Removed portions of a ground plane that serves to isolate it form a hole in the base material to which the plane is attached
A conductor layer, or portion of a conductor layer, used as a common reference point for circuit returns, shielding, or heat sinking. All those areas, not consumed by traces or pads, of the PCB which ...
An orthogonal network of two sets of parallel, equidistant lines used for locating points on a printed circuit board.
A coating process in which a set portion of resin is dispensed on the top of a chip or board. After spreading over the entire surface ,it is cured to form a soild protective coating.
TG-value, temperature at which resin ceases to act as a solid, Till this temperature, no separation will take place between resin/copper/reinforcement.
A material used to fabricate printed circuit boards. The base material (fibre-glass) is impregnated with an epoxy filler which then must have copper laminated to its outer surface to form the material...
Vector-based language, developed by Gerber Scientific Instrument Company, for sending commands to photoplotters.
A metallic coating, usually tin or solder alluvia, which has been melted and solidified forming a metallurgical bond to the base material.
To check an assembly using equipment that tests for the functions intended and engaging inputs and outputs.
An additive process wherein the entire thickness of electrically isolated conductors is built-up by copper.
Convection, consisting of flow, rate, velocity and temperature, as heat transfer of fluid or gas over solder joints to be re-flowed.
Ranking | Name | Answers |
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1 | PCBWay Team | 6 |
2 | Engineer | 1 |
3 | Stephen Newport | 1 |