A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached. (Also called land).
Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.
Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.
The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.
The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.
An area of a bare PCB which, due to over-etching or fabrication problems, separates two electrically connected points.
A test instrument measuring ionic residues on PCBs via the drop of resistivity over a specific time.
A condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.
Material having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.
A land on internal or external layers, not connected to the conductive pattern on its layer.
A configuration formed by functional non-conductive material of a printed circuit.
An epoxy resin with or without a filler, which may be added to improve thermal conductivity.
Ranking | Name | Answers |
---|---|---|
1 | PCBWay Team | 6 |
2 | Engineer | 1 |
3 | Stephen Newport | 1 |