A polymer resin (Polyparaxylense) that provides a thin, uniform coating on PCBs and components. It can be applied via vacuum for deposition on sharp edges and complex shapes.
Shiny Li
Jan 28,2016
553 views
The plating of the entire surface of a panel (including holes).
Shiny Li
Jan 28,2016
711 views
The base material containing one or more circuit patterns that passes successively through the production sequence and from which printed circuit boards are extracted. See Backplanes/Backpanels.
Shiny Li
Jan 28,2016
718 views
A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached. (Also called land).
Shiny Li
Jan 28,2016
617 views
Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.
Shiny Li
Jan 28,2016
944 views
Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.
Shiny Li
Jan 28,2016
1546 views
The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.
Shiny Li
Jan 28,2016
903 views
The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.
Shiny Li
Jan 28,2016
806 views
A water-soluble flux using organic acids as activators.
Shiny Li
Jan 28,2016
751 views
An area of a bare PCB which, due to over-etching or fabrication problems, separates two electrically connected points.
Shiny Li
Jan 28,2016
941 views
A test instrument measuring ionic residues on PCBs via the drop of resistivity over a specific time.
Shiny Li
Jan 28,2016
975 views
A condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.
Shiny Li
Jan 28,2016
934 views
Material having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.
Shiny Li
Jan 28,2016
936 views
A land on internal or external layers, not connected to the conductive pattern on its layer.
Shiny Li
Jan 28,2016
1648 views
A configuration formed by functional non-conductive material of a printed circuit.
Shiny Li
Jan 28,2016
888 views
An epoxy resin with or without a filler, which may be added to improve thermal conductivity.
Shiny Li
Jan 28,2016
1025 views
A process using specially formulated low-solid solder pastes whose residues require no cleaning.
Shiny Li
Jan 28,2016
930 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | _ Floppy Lab | 4 |
| 2 | PCBWay Team | 3 |
