I am looking at designing a 2 layer PCB with through hole components that will sink 10 Amps of current. I understand that I need to make the width of my trace large enough to handle 10 Amps. My question is do i need to worry about the platting thickness on my platted through hole? The hole will contain the component lead and solder so does that negate the need to make sure the platting thickness will handle 10 Amps?
i would like to stick with a 1 oz, 2 layer board.
This is for a DC power distrubution board.
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Thanks for the response. I am using that tool. The tool assumes you are passing current from one layer to another through the via. In my case I am passing current from one layer to the component pin. Does that factor in to the equation at all? What do you mean by stack up multiple vias? My top layer is power and my bottom layer is ground. Where do the vias go?
For the case of current going from a trace on the bottom, through a pin in a PTH, I don't think the plating thickness would much affect the current capability. Remember, "current capability" is usually defined as the current required to raise a condutor temperature by a certain amount. The resistance, material, and shape of conductor (and some others like whether it is enclosed, whether there's air flow over it, etc) will affect this. I'd have to see your schematic and layout to be sure, but if all of the current is going through the component with the lead then it's likely you won't need any extra vias. If the component is designed to be able to pass 10A through its pins, then I don't see any need to worry about the plating on the PTH.
Thanks. I would be happy to send you my schematic and layout and Gerber if you like. The design is very simple from a schematic perspective. It is power coming on to the board, it is split into 12 fused outputs on the board. The only components are the fuse holder, terminal block and bus bar.
Thanks. In terms of determining how much current can pass from my pad to the component pin which is located in the hole, does the platting thickness of the hole mater?
The is a power distribution board. My top layer is power and my bottom layer is ground. Where do i add the vias? Does that fact that i have a component pin and solder in the hole factor into the equation at all?