I am looking at designing a 2 layer PCB with through hole components that will sink 10 Amps of current. I understand that I need to make the width of my trace large enough to handle 10 Amps. My question is do i need to worry about the platting thickness on my platted through hole? The hole will contain the component lead and solder so does that negate the need to make sure the platting thickness will handle 10 Amps?
i would like to stick with a 1 oz, 2 layer board.
This is for a DC power distrubution board.
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