Test for the level of resistance of an insulating material, such as FR-4.between conducting members of a board (traces, contacts).
A hole in a printed board that has its inside surface plated or otherwise reinforced.
A process for obtaining conductive patterns by selective removal of unwanted areas of conductive foil from a metal clad base material.
A type of transmission line configuration which consists of a single narrow conductor parallel and equidistant to two parallel ground planes.
A component lead that extends through a hole and is terminated without subsequent forming.
A method by which successive exposures of a single image are made to produce a multiple-image production master.
The making of solder connections by sequentially using solder alloys with successively lower melting temperatures.
The use of statistical techniques to analyse the outputs of processes with the results guiding actions taken to adjust and/or maintain a state of quality control.
Wiring which is produced by die stamping and which is bonded to an insulating base.
A method of connecting a solid wire to a square, rectangular, or V-shaped terminal by tightly wrapping the wire around the terminal with a special tool.
A process of joining metallic surfaces with solder, without the melting of the base metals.
The portion of a soldering iron that is used for the application of the heat that melts the solder.
Ranking | Name | Answers |
---|---|---|
1 | PCBWay Team | 6 |
2 | Engineer | 1 |
3 | Stephen Newport | 1 |