Pad

A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached.  (Also called land).

Pad

Packaging Density

Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.

Packaging Density

Overhang

Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.

Overhang

Outgrowth

The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.

Outgrowth

Outgassing

The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.

Outgassing

OSP

Organic Solderable Preservative.

OSP

Organic Activated (OA)

A water-soluble flux using organic acids as activators.

Organic Activated (OA)

Open

An area of a bare PCB which, due to over-etching or fabrication problems, separates two electrically connected points.

Open

One-sided Board

See Single-sided Board.

One-sided Board

Omegameter

A test instrument measuring ionic residues on PCBs via the drop of resistivity over a specific time.

Omegameter

NPTH

Non plated though-hole.

NPTH

Non-wetting

A condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.

Non-wetting

Non-polar Compound

Material having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.

Non-polar Compound

Non-functional Land

A land on internal or external layers, not connected to the conductive pattern on its layer.

Non-functional Land

Non-conductive Pattern

A configuration formed by functional non-conductive material of a printed circuit.

Non-conductive Pattern

Non-conductive Epoxy

An epoxy resin with or without a filler, which may be added to improve thermal conductivity.

Non-conductive Epoxy

Non-clean solder

A process using specially formulated low-solid solder pastes whose residues require no cleaning.

Non-clean solder

Node

A pin, lead or even junction which will have at least one wire connected to it.

Node

NFP

Non-functional pad.

NFP

Neutralizer

An alkaline chemical added to water to improve its ability to dissolve flux residues.

Neutralizer

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