Pin

A terminal on a component. A component lead that is not readily formable without being damaged.

Pin

Pin Density

The quantity of pins on a printed board per unit area.

Pin Density

Pilot Hole

See Locating Hole.

Pilot Hole

PIH Assembly

Pin-in-hole a printed board assembly made up of components with leads which pass through holes in the board and lands. Synonyms: traditional assembly, conventional assembly.

PIH Assembly

Pick-and-place Machine

A programmable machine usually with a robot arm for picking components from a feeder. It moves the part for placement and/or insertion to a specific site on the board.

Pick-and-place Machine

Physical Layer

A conductive board layer or artwork image representing a complete conductive layer.

Physical Layer

Photoplotter

A plotter that writes using light.

Photoplotter

Photopolymer

A polymer that changes characteristics when exposed to light of a specific frequency.

Photopolymer

Photomaster

See Artwork Master.

Photomaster

Permanent Mask

A resist which is not removed after processing, e.g., plating resist used in the fully-additive process.

Permanent Mask

Peel Strength

The force per unit width required to peel the conductor or foil from the base material.

Peel Strength

PEC

Printed Electronic Component.

PEC

PCB

Printed Circuit Board.

PCB

Pattern

The configuration of all conductive and/or non-conductive areas on a PCB. Letters and inscription may also be included. Pattern also denotes the circuit configuration on related tools, drawing and mas...

Pattern

Pattern Plating

 Selective plating of a conducive pattern.

Pattern Plating

Parylene

A polymer resin (Polyparaxylense) that provides a thin, uniform coating on PCBs and components. It can be applied via vacuum for deposition on sharp edges and complex shapes.

Parylene

Panel Plating

The plating of the entire surface of a panel (including holes).

Panel Plating

Panel

The base material containing one or more circuit patterns that passes successively through the production sequence and from which printed circuit boards are extracted. See Backplanes/Backpanels.

Panel

Pad

A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached.  (Also called land).

Pad

Packaging Density

Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.

Packaging Density

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