Common in LED lighting products. There are pros and cons, the white side is soldered LED pin, the other side showing the aluminum color, usually applied thermal plasma coagulation after contact with the conductive portion. There are still a ceramic substrate and so on.
Aluminum plate (heat radiation metal base plate (including aluminum plate, copper substrate, iron substrate)) is a unique metal base copper clad laminate, which has good thermal conductivity, electrical insulation properties and mechanical workability.
Its good thermal performance and favorable price than the copper substrate, as well as beyond the hardness of the ceramic plate is the preferred carrier of various types of lamps!
1. Definitions
Aluminum base plate is a metal having good heat dissipation CCL, generally consists of three single-panel structure, namely the circuit layer (foil), the insulating layer and the metal substrate. Also used for high-end dual-panel design, the structure of the circuit layer, an insulating layer, aluminum, an insulating layer, a circuit layer. Very few applications of plywood, plain plywood can be made with the insulating layer, aluminum bonding together.
LED aluminum plate is the PCB, the PCB also mean, just the circuit board material is aluminum, we used the average fiberglass circuit board material, but because the LED heat larger, so the board is generally used for LED lamps aluminum plate, can heat quickly, electrical circuit boards or other equipment used in class or fiberglass board!
2. works
Power device surface mounted on the circuit layer , the heat generated during operation of the device through the insulating layer to a conductive metal substrate quickly , and then the metal substrate to transfer heat out of the device in order to achieve cooling .
And the ratio of the conventional FR-4 , the thermal resistance of the aluminum substrate can be minimized , so that the aluminum plate having an excellent thermal conductivity ; compared with the thick film ceramic circuit which is extremely excellent in mechanical properties .
In addition , aluminum plate as well as the unique advantages:
Ø with RoHs requirements ;
Ø more adapted to the SMT process ;
Ø In the circuit design of thermal diffusion in a very effective treatment , thereby reducing the module operating temperature and prolong life , increase power density and reliability ;
Ø reduce the radiator and other hardware ( including thermal interface material ) assembly , smaller footprint , lower hardware and assembly costs ;
Ø The power and control circuits optimized combination ;
Ø replace the fragile ceramic substrates, better mechanical durability .
3. constitutes
Line layer
Line layer ( generally electrolytic copper foil) formed after etching printed circuit assembly and connecting devices for implementing the .
Compared with the conventional FR-4, the same thickness , the same width, the aluminum plate can carry a higher current .
Insulating layer
Insulating layer is aluminum plate core technology , primarily as bonding, insulation and thermal features. Aluminum plate structure insulating layer is the largest power module thermal barrier. Better thermal conductivity of the insulating layer , the more conducive to the spread of heat generated during operation of the device , the more beneficial to reduce the operating temperature of the device, so as to improve the power load modules , reduce the volume, prolong life, increase power output and other purposes .
Figure 5 is a typical motor controller module , where the right of the icon using traditional techniques (FR-4), using a lot of heat sink , thermal interface materials and other accessories , a large block size, complex structure, high assembly costs ; while the left side because the use of high thermal conductivity of aluminum plate, got a highly automated surface mount products , the whole product components was reduced from 130 to 18 , the power load is increased by 30% , much smaller modules . Such high power density modules , only the high thermal conductivity of aluminum plate be competent.
Metal grassroots
What kind of metal insulated metal substrate , depending on the need of a thermal expansion coefficient of the metal substrate , considering the thermal conductivity , strength, hardness, weight , surface condition and cost conditions.
In general, the cost and technical performance conditions to consider, aluminum is an ideal choice. Choice of aluminum have 6061,5052,1060 and so on. If higher thermal conductivity, mechanical properties, electrical properties and other special performance requirements , copper, stainless steel, iron , and silicon steel plate, etc. may be used.
4. Structure
Aluminum clad circuit board material is a metal , copper foil , and the thermal insulation layer consisting of a metal substrate , the structure of three layers :
Cireuitl.Layer line layer : the equivalent of an ordinary PCB CCL , foil thickness loz line to 10oz.
DielcctricLayer Insulation: insulation layer is a layer of thermal insulation materials with low thermal resistance . Thickness : 0.003 " to 0.006" inches is the core gauge aluminum clad where surgery has received UL certification.
BaseLayer grass : a metal substrate , typically aluminum or copper can be chosen . Aluminum clad and traditional epoxy glass cloth laminated panels
Circuit layers ( i.e. the copper foil) are usually formed after etching printed circuits, so that all components of the assembly interconnected , under normal circumstances , the circuit layer requires a large current carrying capacity , so that use of a thicker foil , a thickness of 35μm ~ 280μm; thermal insulation layer is aluminum plate where the core technology, which is generally a special polymer constituted by a special ceramic -filled , small thermal resistance , excellent viscoelastic properties , the ability to heat aging , able to withstand the mechanical and thermal stresses.
The company produces high-performance thermal insulation aluminum plate is used this technology , it has a very good thermal conductivity and high strength electrical insulation properties ; metallic aluminum plate grassroots support member is required to have a high thermal conductivity , usually aluminum, copper can also be used (where copper can provide better thermal conductivity ) , suitable for drilling, punching and cutting and other conventional machining.
PCB material has advantages compared to other materials incomparable . SMT surface mount power components suitable for public art .
No radiator , much smaller , excellent heat dissipation , good insulation properties and mechanical properties.
5. Features
Aluminum plate (heat radiation metal base plate (including aluminum plate, copper substrate, iron substrate)) is a low-alloyed Al-Mg-Si based alloy sheet of high plasticity (structure shown below), which has good thermal conductivity, electrical insulation mechanical properties and processing properties, as compared with the conventional aluminum plate FR-4, the same thickness, the same width, the aluminum plate can carry a higher current, the aluminum plate pressure up 4500V, the thermal conductivity of greater than 2.0, industry with aluminum plate based.
● using surface mount technology (SMT);
Street light aluminum plate
● The circuit design of thermal diffusion in a very effective treatment;
● reduce product operating temperature, increase power density and reliability, extend product life;
● smaller footprint, lower hardware and assembly costs;
● replace the fragile ceramic substrates, better mechanical durability.
6.Application Features
Aluminum PCB board by its own constitution , has the following characteristics : thermal performance is very good , single Mianfu copper , the device can only be placed in tied copper surface , electrical connection can not open holes so as not to place the jumper in accordance with a single panel .
Aluminum PCB board are generally placed patch devices, switch, output rectifier conduction through the substrate out of the heat , the thermal resistance is very low , you can get a higher reliability. Transformer using planar chip structure , but also the heat through the substrate, its temperature is lower than conventional , the same specifications as the transformer structure with aluminum PCB board available larger output power. Aluminum PCB board jumpers can be used bypass manner. Aluminum PCB board power generally consists of two printed circuit board composition, place another piece of board control circuit connected through integrated physical synthesis between the two plates .
Since aluminum PCB board excellent thermal resistance, the small hand- welding is difficult, the solder cools fast , simple and easy and practical way to an existing problem , a conventional ironing irons ( preferably with thermostat function ) , turn it over , ironing facing , fixed, and the temperature to about 150 ℃, the aluminum PCB board on top irons , heating time, and then paste the component according to conventional methods and welding iron temperature devices easy welding is appropriate, too high may damage the device , or even aluminum PCB board copper stripping , soldering temperature is too low, the effect is not good, to be flexible.
7. Use
Aluminum plate uses: power hybrid IC (HIC).
Audio Equipment
Input, output amplifier, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
Power Equipment
Switching regulator `DC / AC converter` SW regulator and the like.
Electronic communication equipment
High-frequency amplifier `filter` transmitter electrical circuit.
Office automation equipment
Motor drives.
Car
Electronic ignition `` regulator power controllers.
Computer
CPU board `` floppy drive power devices.
Power Modules
Inverters `solid` relay rectifier bridges.
Lamps
As advocates for the promotion of energy-saving lamps, energy-saving LED lights gorgeous received by the market, while the aluminum plate used in LED lights have begun large-scale applications.
8. Classification
Aluminum plate in accordance with the process can be divided into: HAL aluminum plate, anti-alumina substrate, silver-plated aluminum plates, gold aluminum plate, etc.; according to use can be divided into: street light aluminum plate, aluminum plate lamp, LB aluminum plate, COB aluminum plate , packaging aluminum plate, aluminum plate bulb, power aluminum panels, automotive aluminum plate and so on.
Thermal path through the above explanation , that package can choose its grain cooling LED substrate material scattered on the LED thermal management accounts for a very important part , the section will outline instructions for doing LED cooling aluminum plate .
LED cooling aluminum plate
LED cooling aluminum plate is mainly the use of its thermal substrate material itself has better thermal conductivity, the heat derived from the LED die . Therefore, we describe the thermal path from the LED , LED heat dissipation substrates can be subdivided two categories , namely (1) LED crystal substrate and ( 2 ) the system board , these two different substrates , respectively, multiplied by carrying heat LED chip LED die and the LED die to the heat generated by the light emission , the heat radiation substrate through the LED die to the system board , and then absorbed by the atmosphere , in order to achieve the effect of the bulk of the heat , the aluminum plate Fox current brand market occupied Wright mainstream land.
LED crystal substrate
LED crystal substrate between the LED die primarily as circuit boards and systems derived medium heat , by wire , eutectic or process combined with the LED die flip chip . And based on thermal considerations, LED crystal substrates currently available mainly in the ceramic substrate mainly to a prepared line different methods can be roughly divided into : three thick film ceramic substrate ceramic substrate , low temperature co -fired ceramic , as well as in traditional high power LED components, mostly thick-film or LTCC substrate as grain thermal substrate , then the goldsmith -line LED die and the ceramic substrate binding . As a preface , this golden thread link limits the performance of heat loss along the electrode contacts. Thus , in recent years , domestic and foreign manufacturers all efforts towards solving this problem . Its solution has two , one for looking for a high heat transfer coefficient of the substrate material to replace aluminum , contains a silicon substrate , silicon carbide substrate , anodized aluminum plate or aluminum nitride substrate , wherein the substrate material silicon and silicon carbide semiconductors features that make it more stringent test stage encounter , and then anodized aluminum plate anodized oxide layer because of its lack of strength and susceptible to fragmentation lead to conduction, it is limited in practical application , therefore , at this stage more mature and high degree of general acceptance as a heat sink is aluminum nitride substrate ; however , currently limited to aluminum nitride substrate does not apply traditional thick film process ( after printing silver paste material subject to 850 ℃ atmosphere heat treatment, it appears materials trust issues ) , therefore , need to line aluminum nitride substrate thin film process equipment system . Process to prepare a thin film made of an aluminum nitride substrate greatly accelerate the effectiveness of the system circuit board via the heat from the LED die to the substrate material , thus significantly reducing the burden of the heat generated by the LED die through the wire to the system board , and then to heat dispersion effect.
9. production process
First, is expected to open
1 ) , is expected to open in the process picking - Cut
2 ) , a material purpose
The large size of the incoming cut to produce the desired
3 ) , is expected to open Precautions
① check is expected to open the first pieces of the first pieces of size
② Note aluminum surface scratches and copper surface scratches
③ Note tiered plate edge and burr
Second, drilling
1 ) , the drilling process
Hit the pin - Drilling - check plate
2 ) , the purpose of drilling
Drilling on the plate positioned for subsequent production processes and customer assembly provide assistance
3 ) , drilling Precautions
① check the number of drill holes , empty size
② Avoid scratches sheet
③ Check the aluminum surface of the burr hole position deviation
④ timely inspection and replacement drill bits
⑤ drilling in two phases , a drill : After cutting and drilling tools for the peripheral holes
Two drill : Unit within the tool hole after solder
Third, the dry / wet film imaging
1 ) , the dry / wet film imaging process
Grinding plate - film - exposure - developing
2 ) , dry / wet film imaging purposes
On sheet showing a part of the production line needed
3 ) , dry / wet film imaging Precautions
① Check whether there is an open line after developing
② developing counterpoint is biased to prevent the generation of dry chopped
③ poor attention caused by the plate surface scratch lines
④ can not have the air to prevent the exposure of residual adverse exposure
⑤ After exposure to developing still more than 15 minutes to do
Fourth, the acid / alkaline etching
1 ) , acid / alkaline etching process
Etching - Stripping - drying - Inspection Board
2 ) , acid / alkaline etching object
The dry / wet film imaging portion of the reserved line needed to remove the excess part of the outside line
3 ) , acid / alkaline etching Notes
① Note etching without a net, over- etching
Note the fine line width and line ②
③ copper surface does not allow oxidation, scratches phenomenon
④ back to back clean and dry
Fifth, solder printing characters
1 ) , screen printing solder , character flow
Screen - Pre- bake - exposure - development - Character
Objective 2 ) , screen printing solder , characters
① solder : do not need to solder circuit protection to prevent a short circuit caused by tin into
② characters: the role played mark
3 ) , note printing solder , characters
① To check the board if there is garbage or foreign
② Check the stencil cleanliness
③ After printing to pre- bake for 30 minutes or more to avoid the line to see bubbles
④ attention to the thickness and uniformity of the screen
⑤ After pre- baking sheet to cool completely , to avoid damage to the ink stick film or surface gloss
⑥ When placed under the ink -oriented development
Sixth , V-CUT, gongs board
1), V-CUT, gongs board process
V-CUT - gong - tear protective film - Deburring
Objective 2), V-CUT, gongs board
① V-CUT: The single- line and the entire PCS PNL leaving a small portion of the plate is connected to the cutting and removal easy to use
package
② gong board: the removal of the excess part of the circuit board
3), V-CUT, gongs board Precautions
① V-CUT V process should pay attention to the size , incomplete edges , burrs
② gong board attention cause glitches , gongs knife skewed, timely inspection and replacement gong knife
③ Finally, when Deburring To avoid scratching board
Seventh, OSP
1 ) , the test , OSP process
Line test - withstanding voltage test - OSP
2 ) test , OSP purpose
① line test : detecting the completed line is working
② withstand voltage test: whether the detection is complete line can withstand the specified voltage environment
③ OSP: Let the line better soldered
Note 3 ) , testing , OSP 's
① How to store after after testing how to distinguish between qualified and unqualified
OSP finish after placing ②
③ avoid line damage
Eighth , FQC, FQA, packaging, shipping
1 ) , the flow
FQC - FQA - packaging - shipping
2 ) , the purpose of
① FQC full inspection to confirm the product
② FQA verification sampling
③ packaging and shipping to customers on request
3 ) , attention
① FQC note confirmation of the appearance of the visual inspection process, make a reasonable distinction
② FQA really FQC test standards for sampling to verify
③ To confirm Packing , avoid mixing board , wrong plates and damaged packaging
10. aluminum plate structure and properties
Aluminum clad is made of aluminum, epoxy glass cloth epoxy adhesive gum or tablets, copper three by hot pressing. Aluminum thickness who is 0.8mm ~ 3.0mm, by use of different options. Aluminum clad with excellent thermal dissipation, size invariance, electromagnetic shielding and mechanical strength.
According to the structure and function of differences in characteristics, aluminum clad divided into three categories: a general-purpose aluminum clad, the insulation layer is made of glass cloth epoxy adhesive film composition; b aluminum clad high heat, the insulation layer. by the high heat of epoxy or other gum gum composition;. c aluminum clad high-frequency circuits, the insulation layer of a polyolefin gum or gum glass cloth adhesive polyimide film composed of aluminum clad and Orders. fr-4 CCL biggest difference is that heat dissipation; fr-4 CCL 1.5mm in thickness compared with the aluminum clad former thermal r = 20 ~ 22 ℃, which is the thermal resistance r = 1.0 ~ 2.0 ℃, see The latter suffer more than small.
11. Cooling knowledge
Price of aluminum plate
Single panel from 200 yuan to several hundred dollars. Under normal circumstances, the circular plate prices slightly higher. Its process is divided into stamping and gongs edge technology. Some also need to be drilled. General fluorescent board, 7-9mm as a cutoff point. Below this size for narrow boards. Limited by technology, the size of the board to be higher than the same price of other aluminum plate.
Figure aluminum plate products
Circuit board by the aluminum layer (copper layer), and a thermal insulation layer composed of the metal substrate. Circuit layer requires a large current-carrying capacity, so you should use thick copper foil, thickness of 35μm ~ 280μm; thermal insulation layer PCB aluminum plate is where the core technology, which is usually filled by a special ceramic special polymer structure, thermal resistance, excellent viscoelastic properties, heat aging has the ability to withstand mechanical and thermal stresses. IMS-H01, IMS-H02 and PCB LED-0601 high performance thermal insulation of aluminum plate is used this technique, it has an extremely high thermal conductivity and excellent electrical insulation strength; the metal substrate is an aluminum plate The support member is required to have a high thermal conductivity, typically aluminum, copper can also be used (where copper can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional machining. Process requirements are: gold, HAL, osp antioxidant, gold, lead-free ROHS process, etc.
12. Production capacity
Maximum processing area
Thickness
The minimum line width
Minimum spacing 0.10mm
Minimum aperture 0.15mm
PTH wall thickness> 0.025mm
Metal tolerance of ± 0.05mm aperture
Non-metallic aperture tolerances e ± 0.05mm
Hole tolerance ± 0.076mm
Dimension Tolerance ± 0.1mm
Slotted 30 ° / 45 ° / 60 °
Minimum BGA pad 14mil
PCB impedance control ≤ 50Ω ± 5Ω
> 50Ω ± 10%
The most wide-solder mask bridge
The minimum width of solder mask thickness
Insulation Resistance
Peel Strength
Solder resist hardness
Heat the shock test
Continuity test voltage
Dielectric constant
Volume resistivity
13. Test Project
Experimental conditions
Typical values
Thickness
Performance Parameters
Peel strength
Resistance to soldering
Non-hierarchical, non-foaming
Breakdown voltage
Thermal Resistance
Cooked impedance
Thermal conductivity
Surface resistance
Volume resistivity
Permittivity
Dielectric Loss
Flammability
※ The above is only the thickness of the layer thickness, excluding copper and copper.
Structure
Insulation thickness: 75 um ±% conductor thickness: 35um ± 10%
Metal Thickness: 1.0mm ± 0.1mm
14. Storage conditions
Aluminum plate is generally stored in a dark, dry environment, most likely aluminum plate extremely damp, yellow and black, generally open to use within 48 hours after vacuum packaging.
15. works
Power devices in surface mount circuit layer of heat, generated by devices running fast conduction through the insulating layer to the metal substrate, and then the metal substrate to transfer heat out, in order to achieve thermal and conventional FR-4 devices compared to aluminum plate Low thermal resistance can be reduced, so that the aluminum plate having an excellent thermal conductivity; thick film ceramic circuit ratio, which is extremely excellent in mechanical properties.
16. Model
Common metal mainly aluminum plate aluminum plate 1000, 5000 and 6000 lines, three lines of aluminum which are basic characteristics: ① 1000 series represents 1050, 1060, 1070, 1000 series aluminum is also known as pure aluminum, in all Series 1000 Series are the largest aluminum content, purity can reach 99.00%. Because they do not contain other technical elements, so the production process is relatively simple, relatively inexpensive, is currently the most commonly used in conventional industrial series. Most of the market circulation of 1050 and 1060 series. 1000 series aluminum is determined according to the last two digits of the minimum aluminum content of the series, such as the 1050 series the last two digits of 50, based on the principles of international brand names, its aluminum content of 99.5% must be achieved for qualified products. In China's aluminum technology standard (GB/T3880-2006) is also clear that the 1050 aluminum content of 99.5%. By the same token 1060 series aluminum sheet to reach 99.6%. ② 5000 series represents 5052,5005,5083,5 A05 series. 5000 series aluminum is more commonly used aluminum alloy series, the main elements of magnesium, magnesium content between 3-5%, which is also known as aluminum-magnesium alloy. The main characteristics of low density, high tensile strength, elongation, etc. In the same area weight magnesium alloy lower than other series, it is commonly used in aviation, such as aircraft fuel tanks. Also in conventional industrial applications more widely. Its process of casting and rolling, hot-rolled aluminum series, so do oxidation processing. In our 5000 series aluminum is one of the more mature series aluminum. ③ 6000 6061 Series represents mainly contains two elements magnesium and silicon, it focused on the 4000 series and 5000 series of advantages 6061, a cold finished aluminum wrought products for corrosion resistance and oxidation resistance demanding applications. Good use interface features excellent, easy coating, good processability. 6061 general characteristics: excellent interface characteristics, easy coating, high strength, good workability, corrosion resistance. Typical uses 6061 aluminum: aircraft parts, camera parts, couplers, marine accessories and hardware, electronic components and connectors and so on. From the aspect of the material itself texture, hardness, elongation, chemical properties and price considerations, aluminum plate commonly used in the 5000 series aluminum 5052 alloy aluminum.
17. Brand
The aluminum plate market brands: Beggs brand, used in LED lighting industry and electronics cooling industry, widely used, is the future trend of the cooling industry and navigation.
18. slitting
Aluminum plate cut has specialized cutting equipment, commonly known as aluminum plate scoreboard.
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