The rapid development of electronic information industry, electronic products to small, functional, high performance, high reliability direction. From the mid- 20th century, the general surface mount technology 70s (SMT), installation technology (HDI), as well as a variety of new packaging technologies are applied to the surface of high-density interconnect the 1990s emerged in recent years semiconductor packaging , IC packaging technology, electrical installation technology continues to develop in the direction of higher density . While high-density interconnect technology to promote high-density PCB also the direction of development. Development of technology and the installation of PCB technology, so as PCB substrate material --- CCL technique has been steadily progressing .
Experts predict that the world's electronic information industry over the next 10 years the average annual growth rate of 7.4% , to 2010 the world's electronic information industry market will reach $ 3.4 trillion , which is $ 1.2 trillion electronic machine , computer and communications equipment and representing above which 70 % to $ 0.86 trillion . Thus, as a huge market for electronic materials based CCL will not only continue to exist, and is growing at 15% growth in constant development. CCL industry associations publish relevant information indicates that the next five years , in order to meet the development trend of high-density BGA technology, semiconductor packaging technology, the proportion of high-performance thin FR-4, high-performance resin substrate , etc. will be increasing .
Copper clad laminate (CCL) as a substrate material in the manufacture of PCB , the PCB interconnect from the main conduction , insulation, and support the role of a great influence on the signal transmission speed of the circuit , the energy loss , the characteristic impedance , and therefore PCB performance, quality , manufacturing processability, the manufacturing level , the manufacturing cost and long-term reliability and stability of the material depends largely on the CCL .
CCL technology and production through the development process than half a century , and now the whole world CCL production has more than 300 million square meters , CCL has become an important part of electronic information products in the base material . CCL manufacturing industry is a sunrise industry , which along with electronic information, the development of the communications industry , and has broad prospects , its manufacturing technology is a multidisciplinary cross each other , mutual penetration , high-tech and promote each other . History shows that the development of electronic information technology , CCL is one of the key technologies to promote the rapid development of the electronics industry .
Of CCL (CCL) key tasks of the industry in the future development strategy , specific to the product perspective, efforts should be on board with the new material in five categories PCB, namely through the five categories of new substrate materials development and technological breakthroughs , so that our CCL 's cutting-edge technology has improved. Development of the following five categories listed in this new high performance of CCL products are key topics of engineering and technical personnel CCL industry research and development in the future to be of concern.
First, the lead-free compatible CCL
In the EU 's October 11, 2002 meeting, adopted two environmental content of the " European Directive ." They will take effect July 1, 2006 the full implementation of a formal resolution . Two " European Directive " means " electrical and electronic products Waste Directive " (the WEEE) and " limit the use of certain hazardous substances in order" ( referred to as RoHs), in both regulatory instructions, are explicitly mentioned the need to prohibit the use of lead-containing materials , therefore , the development of lead-free as soon as possible is the best way to deal with CCL these two directives .
Second, high-performance CCL
High performance CCL referred to here , including low dielectric constant (Dk) CCL , high-frequency high-speed PCB with CCL, CCL high heat resistance , multilayer laminated with a variety of substrate material law ( resin coated copper foil , an organic resin film having a multilayer laminated insulating layer method , other organic fiber reinforced or glass fiber-reinforced prepreg , etc. ) . The next few years ( to 2010 ) , in the development of this type of high-performance copper clad laminate , according to forecast the future development of electrical installation technology, should reach a value corresponding performance indicators .
Three , IC package substrate with the substrate material
IC package substrate carrier material development (also called an IC package substrate ) used, the current is a very important task . Also the development of China's IC packaging and microelectronic technology is an urgent need . With the IC package to the high frequency, low consumption power of direction , IC package substrate performance will be low in important dielectric constant, low dielectric loss factor , high thermal conductivity , such as improved. An important issue in the future research and development of technology is thermally connected to the substrate - heat dissipated coordination of effective thermal integration.
In order to ensure the development of IC package design freedom and new IC packaging technologies , conduct modeling experiments and simulated tests are indispensable . Both work for the master IC package substrate material property requirements , understand that its electrical performance , heating and cooling performance and reliability requirements of the master is of great significance . In addition , it should be further communication with the IC package design industry to reach a consensus. The performance of the developed substrate material , in time for the designers of the whole electronic products to enable designers to build accurate , advanced data base .
IC package substrate and the semiconductor chip also need to address the problem of inconsistency of thermal expansion coefficients . Even for the production of fine circuit multilayer laminate method , there is also an insulating substrate generally a large coefficient of thermal expansion ( coefficient of thermal expansion generally 60ppm / ℃) problems. Coefficient of thermal expansion of the substrate and the semiconductor chip reach close to 6ppm, indeed substrate manufacturing technology is a " difficult challenge ."
To meet the high speed of the dielectric constant of the substrate should be up to 2.0 , dielectric loss factor can approach 0.001 . To this end, beyond the traditional substrate material and the boundaries of the traditional manufacturing process of a new generation of printed circuit boards, predicted there will be around 2005 in the world. The technological breakthrough , the first breakthrough in the use of new substrate materials.
Predict the future development of IC package design, manufacturing technology, the substrate material it uses more stringent requirements. This is mainly manifested in the following aspects : (1) lead-free solder and high Tg of the corresponding . 2 achieved with characteristic impedance matched low dielectric loss factor of . 3 and corresponding to the speed of a low dielectric constant (ε should be close to 2 ) . 4 low degree of warpage ( flatness of the substrate surface improved ) . 5 Low moisture absorption whims . 6 a low thermal expansion coefficient , the thermal expansion coefficient is close to 6ppm. 7.IC cost of the package substrate . 8 low-cost substrate materials of built components . 9 In order to improve the thermal shock resistance , and mechanical strength of the basic improvement . Suitable temperature change cycles without performance degradation from high to low substrate material . 10. Achieve low cost resistance, suitable for high temperature reflow green type substrate material.
Fourth, with special functions CCL
CCL special functions referred to here mainly refers to : a metal base ( core ) CCL, CCL ceramic-based , high- permittivity board, embedded passive component type plywood with CCL ( or substrate material ) optical - electrical wiring substrate CCL . Develop, produce this type of CCL, require not only the development of new technologies of electronic information products , but also the development of China's aerospace, military 's needs .
Five , high performance FCCL
Arrogant industrialized production of flexible printed circuit board (FPC) since it has experienced more than 30 years of development. 1970s , FPC began to enter the large-scale production real industrialization. The development of the late 1980s, due to the advent and application of a new class of polyimide film material , so there has been no FPC bonding formulations FPC ( generally referred to as " two-story type FPC"). In the 1990s, developed the world with high-density circuit corresponding photosensitive coating film , making the FPC has made significant changes in terms of design . Due to open up new application areas , the concept of it took place in the form of product is not small change , which it expanded to include a wider range TAB, COB with the substrate. In the latter half of the 1990s, the rise of high-density FPC began to enter the large-scale industrial production . It 's a circuit pattern , the more dramatic the fine level of development . High-density FPC market demand is growing rapidly .
The world production of FPC output value last year reached about 3 billion -35 billion. In recent years , world production of FPC is growing . Its share of the PCB in the proportion increasing every year. In the United States and other countries , FPC accounted for the entire value of the proportion of the printed circuit board has now reached 13% -16%, FPC PCB is increasingly becoming a class of very important and indispensable varieties.
FCCL our country , whether it is in the scale of production, or in the level of manufacturing technology and raw materials manufacturing technology , are associated with the world's advanced countries , there are significant regional disparities , the gap is even greater than the rigidity of CCL .
Summary
CCL technologies and the development and production of electronic information industry , especially with the development of PCB industry is synchronized , indivisible . This is a constant innovation and pursuit of the process , progress and development of the CCL , but also by electronic machine products, semiconductor manufacturing technology, electrical installation technology, the development of PCB manufacturing technology innovation driven , in this case , common progress simultaneous development is particularly important .
