Manual prototype PCB assembly or component-level repair is more difficult and requires skilled operators and more expensive tools, due to the small sizes and lead spacings of many SMDs.
SMDs cannot be used directly with plug-in breadboards (a quick snap-and-play PCB prototyping tool), requiring either a custom PCB for every prototype or the mounting of the SMD upon a pin-leaded carrier. For prototyping around a specific SMD component, a less-expensive breakout board may be used. Additionally, stripboard style protoboards can be used, PCB some of which include pads for standard sized SMD components. For prototyping, "dead bug" breadboarding can be used.
SMDs' solder connections may be damaged by potting compounds PCB going through thermal cycling.
Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. Voiding PCB is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMT application. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
SMT is unsuitable for large, high-power, or high-voltage parts, for example in power circuitry. It is common to combine SMT and through-hole PCB construction, with transformers, heat-sinked power semiconductors, physically large capacitors, fuses, connectors PCB, and so on mounted on one side of the PCB through holes.
SMT is unsuitable as the sole attachment method for components that are subject to frequent mechanical stress, such as connectors that are used to interface with external devices PCB that are frequently attached and detached PCB.
