Background of Research
Miniaturization of electronic products is developing in a dramatic speed in past decade. Under this circumstance, printed circuit board industries coming up with this trend.
Printed circuit board production development
Single side =>Double side =>Multi-layer=>High Density Interconnection (HDI)
The difficulties of production in printed circuit board increase with the circuit density.
The followings are the comparison of typical capability and the HDI.
In the production of high density circuit, we have to face the following problem in plating
1. Uneven distribution
2. Poor throwing power
3. Burnt deposits
Pulse plating is the solution that can minimized the difficulties we in the copper plating process.
Objective
1. To enhance the metal distribution uniformity
2. To increase productivity of plating by changing the physical parameter of the plating conditions.
