Innovation of printed circuit boards, the first is that PCB product and market innovation.
The innovation of the printed circuit, based on technology innovation. Noise electronic printed circuit (PEC) products and technology has brought the revolutionary change to the PCB.
Printed circuit board (PCB) is indispensable to modern electronic equipment accessories, high-end electronic devices, regardless of the god of the sea or household appliances and electronic toys are not load electronic components and electrical signals of PCB, the PCB is along with the development of the electronic information industry and the development.
Innovation of printed circuit boards, the first is that PCB product and market innovation. The earliest PCB products are single panel, with only a conductor layer on insulation board, line width in millimeters, are commercial used in semiconductor transistor radio. Later, along with the arrival of such as TV, computer, PCB product innovation, then a double panels, multilayer, conductor layer or multilayer insulation board, line width is reduced gradually. In order to adapt to the electronic device miniaturization, lightweight development, again and just scratch combined with flexible PCB PCB.
Now, PCB, the main market in computer (computer and peripheral equipment, communications equipment (base station and hand-held terminals, etc.), household electronics (TVS, cameras, game consoles, etc.) and automotive electronics and other fields, PCB product is given priority to with multilayer and high-density interconnect (HDI) board. Along with the computer to the high-speed and large capacity, the mobile phone to the multifunctional intelligent, TV to high-definition 3 d, cars to develop in the direction of high security intelligence, HDI PCB also shift from wire connection to electronic circuit function, namely the PCB products in addition to the basic of conductor line, also includes passive components such as resistors, capacitors and active components such as IC chip. A new generation of HDI PCB is internal contain embedded components, PCB components. Update the generation of PCB for high frequency signal transmission applications, high-speed PCB layers will contain fiber and waveguide, form suitable for use in more than 40 GHZ signal transmission photoelectric PCB.
Because of PCB product innovation, we have a spring and a printed circuit development. Smart phones will bring the climax of embedded components, PCB, LED energy-saving lighting will bring the climax of metal base printed circuit board, e-books and film display will bring the climax of the flexible circuit board.
The innovation of the printed circuit, based on technology innovation. Traditional PCB manufacturing technology is the copper foil etching method (minus), which USES copper-clad insulating substrate by chemical etching solution to remove unwanted copper layer, leave need copper conductor forming line graphics; For double sided and multilayer interconnection between the layers is implemented by drilling and electroplating copper conduction. Now the traditional process has been difficult to adapt to the micron grade fine lines HDI board production, it is difficult to achieve rapid and low cost production, is also difficult to achieve the purpose of energy conservation and emission reduction, green production, technical innovation is the only thing to change this situation.
High density change is an eternal subject of PCB technology. The characteristics of high density is more fine lines, and smaller interconnection hole, the higher number and thinner. Such as PCB line width/line is apart from the normal ability now has mu m refined from 100 to 75 microns, 50 microns, a few years refinement to 25 microns, 20 microns, therefore, must reform the copper foil etching process innovation.
For printed circuit technology innovation, people have been pursuing a bonus and addition method technology, namely in the insulation substrate deposited copper layer forming line graphics, this is the traditional deducting method improved, although there is progress but still needs a lot of energy consumption, and also higher costs. New path of innovation are electronic printed circuit (PEC), its products and technology has brought the revolutionary change to the PCB. Electronic printed circuit technology with pure printing method for electronic circuit graphics, namely USES the silk screen printing or offset printing or ink jet printing technology, the functional inks, conductive ink, ink semiconductor inks, insulation, etc.) to print on the insulating substrate, the electronic circuit. The technology can simplify the production process, save raw materials, reduce the pollutant, reduce production cost, if equipped with roll type (RolltoRoll) processing equipment, can achieve mass production, low cost more.
The continuous development of electronic printed circuit technology would make the PCB industry to the next level.
