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Multi-Layer PCBs

by: Nov 20,2013 600 Views 0 Comments Posted in Engineering Technical

Double-sided boards, in spite of their benefits, are not the best method of construction, especially for sensitive or high-speed designs. The most common board thickness is 1.5 mm. This separation is too great for full realization of some of the benefits listed above. Distributed capacitance, for example, is very low due to the separation. Critical designs call for multi-layer boards.

Some of the reasons are obvious:

Better routing for power as well as ground connections. If the power is also on a plane, it is available to all points in the circuit simply by adding vias. Other layers are available for signal routing, making routing easier. There will be distributed capacitance between the power and ground planes, reducing high frequency noise. There are other reasons for multi-layer boards, however, that may not be obvious or intuitive.

Better EMI/RFI rejection. There is due to the image plane effect, which has been known since the time of Marconi. When a conductor is placed close to a parallel conductive surface, most of the high frequency currents will return directly under the conductor, flowing in the opposite direction. This mirror image of the conductor within the plane creates a transmission line. Since currents are equal and opposite in the transmission line, it is relatively immune to radiated noise. It also couples the signal very efficiently. The image plane effect works equally well with ground and power planes, but they must be continuous. Any gap or discontinuity causes the beneficial effects to quickly vanish. There is more on this in the following paragraphs.

Reduced overall project cost for small production runs. Although multi-layer boards are more expensive to manufacture, EMI/RFI requirements from the FCC or other agencies may require expensive testing of the design. If there are problems, it can force a complete redesign of the PCB, leading to additional rounds of testing. A multi-layer PCB can have as much as 20-dB better EMI/RFI performance over a 2-layer PCB. If production volumes are going to be small, it makes sense to make a better PCB to begin with, than try to cut costs and take the risk of failing $25,000 to $50,000 tests.

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