Keyword: process of PCB, PCB file, PCB, PCB parameters, PCB original file
PCB from design to production, and involves a lot of things, among which processing factory process capability is directly determine whether the board can make important one annulus. Reasonable ability to conform to the process of PCB parameters can greatly save the design for you to choose output cycle. Regarding some of the basic process parameters of the finishing as follows (parameters for more average single and double panels, laminated and blind buried orifice relaxation parameters under appropriate limit) :
A. The process parameters in the PCB
1. The line
1) the minimum line width: 6 mil (0.153 mm). That is to say, if less than 6 mil line width will not be able to produce and design conditions permitting, design the bigger the better, the bigger the line width, the better factory production, the yield is higher. General design of conventional around 10 mil.
2) minimum distance: 6 mil (0.153 mm). Minimum line distance, is the line to line and line to the welding plate distance not less than 6 mil from the Angle of production, is the bigger the better, conventional in 10 mil, of course design conditional case, the bigger the better.
3) copper to contour line spacing of 0.508 mm (20 mil), line shape to the line spacing of 0.15 mm (6 mil) is minimal.
2. The via hole (known as conductive hole)
1) minimum VIA (VIA) pore size is not less than 0.3 mm (12 mil), welding plate of unilateral not less than 6 mil (0.153 mm), the best there is no restriction on the greater than eight mil (0.2 mm).
2) VIA (VIA) hole to hole spacing, hole to hole while) not less than: 6 mil had better more than 10 mil.
3) welding plate shape to the line spacing of 0.508 mm (20 mil)
3. The PAD bonding PAD (known as plug-in holes (PTH))
1) plug-in holes large components to decide, but must be greater than the components pin, suggested above that is greater than the minimum 0.2 mm tube feet, 0.6 components was designed to be at least 0.8, in case the machining tolerance caused by difficult to plug into,
2) plug-in holes (PTH) welding this ring unilateral not less than 0.15 mm (6 mil), of course, the bigger the better.
3) plug-in holes (PTH) hole to hole spacing, hole edge to the side of hole) not less than: 0.3 mm, of course, the bigger the better.
4) welding plate shape to the line spacing of 0.508 mm (20 mil)
4. The welding
Plug-in holes open the window, SMD window unilateral not less than 0.076 mm (3 mil)
5. Characters (whether the character and character design is very clear)
1) character word wide not less than 0.153 mm (6 mil), words cannot be less than 0.8 mm (32 mil), the word width height ratio for the best 5, for that is to say, high to 1 mm, 0.2 mm wide words in class.
6. Non-metallic slots slots of minimum spacing not less than 1.6 mm or it will greatly increase the difficulty of the edge milling (figure 4)
7. Puzzle
Puzzle puzzle puzzle without clearance and clearance, and don't have clearance puzzle puzzle clearance is less than 1.6 (1.6 mm thickness) or it will greatly increase the difficulty of the edge milling, no clearance makeup general spacing can zero, with a v - cut process, this process of plate size is not less than 80 x80mm. Puzzle work plate is not the same as the large equipment are different, puzzle process side can not less than 5 mm
B, the relevant matters needing attention about PCB original file set (convenient subsequent turn GERBER file)
1. About the PADS designed the original file.
1) spread way of copper PADS, general is Hatch shop copper, customer original file after moving line, need to pave copper save (with Flood spread copper), to avoid short circuit.
2) double panel file PADS in the faces to choose hole attribute (Through), cannot choose buried blind hole properties (Partial), cannot generate drilling files, drilling will lead to leakage.
3) in PADS designed slots do not add in components layer, because cannot generate GERBER, normally to avoid leakage slot, please in DrillDrawing layer groove.
2. About PROTEL99SE and DXP design file
1) the conventional resistance welding is Solder mask layer, if the Solder Paste layer (layer Paste) on the window to do it, and please the resistance welding zone.
2) in Protel99SE contour line, please do not lock to generate GERBER.
3) please do not select a KEEPOUT options within the DXP file, shielding line shape and other components, unable to make GERBER.
4) design of the front side of the two documents please note, in principle, the top is the CNS, the bottom should be designed into the word, when making plate usually superposition of from top to bottom plate. Single chip board pay close attention to, don't mirror! Maybe is to reverse
3. Other matters needing attention.
1) shape (such as plate and frame, slots, V - CUT) must be put in KEEPOUT layer or a mechanical, not on other layers, such as silk screen layer, layer. All need mechanical forming slot or hole placed in a layer as far as possible, please avoid missing slot or hole.
2) if the mechanical and the KEEPOUT layer two layers of appearance, special instructions, please do another appearance wants to shape effectively, if there is a groove inside, outside and inside groove intersect plate shape of line should be deleted, free of leakage gong inside groove, design in mechanical and KEEPOUT layer groove and hole is generally by no copper production to cut copper film (do).
3) if you want to do metallization slot is the safest approach multiple pad together, it must be won't go wrong
4) gold finger plate order to special note whether need to do the bevel edge chamfering processing.
5) to the GERBER file, please check the file whether there is a little layer phenomenon, general company can directly in accordance with the GERBER file.
6) with three kinds of design software, please give special attention to button bits is dew copper.
Source: //www.seekic.com
