One kind of PCB board vacuum plating method, comprising: a PCB board is immersed in the plating solution in the plating bath, at least in the lower side of the PCB board with a row of jets in a direction parallel to the nozzle surface of the PCB, the plating solution through the nozzle PCB board parallel to the discharge, the flow rate of the plating solution in the holes on both sides of the PCB and a negative pressure type, the plating solution in the hole to force the exchange.
The present invention may also be in the lower end sides of the PCB board with a row of jets in a direction parallel to the nozzle surface of the PCB, the PCB and uniformly distributed on the same side of the nozzle, while the opposite side of the PCB board staggered nozzles. Nozzle is a flared nozzle, which trumpet-shaped spray pattern, the angle formed by the range of 5 to 15 degrees. This method enables the flow rate of the plating solution on both sides of the PCB board with a hole and a negative pressure difference, so as to enhance the exchange rate of the plating solution in the hole and effects, good throwing power; especially for high thickness, a high aspect ratio PCB board, plating quality is very good.
