Keyword: PCB interlayer separation, PCB production
1. line section:
(1), break,
A, fracture or discontinuity on line,
B, the line break length longer than 10mm, can not repair.
C, PAD or break in the vicinity of the hole edge (PAD or open circuit at the edge 2mm or less serviceable. Circuit at the edge of the hole from the PAD or greater than 2mm, can not repair)
D, side by side adjacent lines can not break repair.
E, line disconnection gap in the corner, (at the turn of the circuit is less than equal to 2mm, can repair. Circuit at the turn greater than 2 mm, can not repair.)
(2), short circuit,
A, between two lines of a foreign body causing a short circuit, can repair.
B, inner short circuit can not repair.
(3), line gap,
A, line gap is not over 20% of the original width, can repair.
(4), line sag & indentation,
A, the line is not flat, pressed down the line, you can repair.
(5), line wetting,
A, line dip tin (wetting total area of less than or equal 30 mm2, serviceable, wetting area greater than 30 mm2
Can not repair.
(6), line repair bad,
A, supplement or complement the line offset lines do not meet the specifications of the original line size (without prejudice to the minimum width or spacing of the acceptance)
(7), line exposed copper,
A, solder on the line off, serviceable
(8), line hit crooked,
A, less than the original pitch or spacing notches, maintainability
(9), line stripping,
A, between the copper layer and the copper layer has been stripped phenomenon, can not repair.
(10), line spacing inadequate
A, two-line spacing can not exceed 30 percent reduction. Serviceable, more than 30% can not repair.
(11), the residual copper,
A, two line spacing should not exceed 30 percent reduction, maintainability,
B, two from the line ministry can not be more than 30% reduction in maintenance.
(12), line contamination and oxidation,
A, line due to oxidation or contamination leaving part of the line color, dark, can not repair.
(13), line scratches,
A, line caused by scratching exposed copper serviceable, no exposed copper is not considered scratching.
(14), fine lines,
A, line width of less than 20% of the specified width of the non-maintenance....
2, solder parts:
(1)color ( standard : up and down two ) ,
A, board ink colors and standard colors are different. When can control the color table to determine whether the acceptance within the range
(2) Solder vacuoles ;
(3)solder exposed copper ;
A, peeling green paint exposed copper , can repair.
(4) Solder scratch ;
A, solder caused by scratches or exposed copper bottomed timber , could repair
(5)solder ON PAD,
A, Part tin mat & BGA PAD & ICT PAD ink stick , can not repair.
(6) bad patch : green paint coating area is too large or repair is not complete, length greater than 30mm, 10mm2 and larger than the diameter greater than 7mm2 ; non- acceptance .
(7) stained with foreign body ;
A, the solder mezzanine other foreign inclusions . Serviceable .
(8) Ink uneven ;
A, the board has a positive or ink , rugged and affect the appearance , with slight plot ink without maintenance .
(9).BGA VIAHOL not plug the ink ;
A, BGA requires 100% plug ink,
(10).CARD BUS之VIA HOLE Not plug ink
A, VIAHOLE CARD BUS CONNECTOR need 100% of the plug hole . Inspection of non- backlit translucent .
(11).VIA HOLE not plug the hole ;
A, VIA HOLE need 95% cold -hole test method is non- transparent backlight
(12) wetting : no more than 30mm2
(13) pseudo exposed copper ; serviceable
(14) ink colors wrong ; non-repairable
3. through-hole part;
(1), hole plugs,
A, Part holes caused by foreign body parts hole barrier, can not repair.
(2), hole broken,
A, annular hole caused by breaking down the hole barrier, can not repair.
B, point-like holes can not repair broken.
(3), parts hole green paint,
A, Part holes are solder paint, white paint residue cover, can not repair
(4), NPTH, hole soldering
A, NPTH bore hole made PHT can repair.
(5), multi-lock holes, can not repair
(6), the drain hole lock, can not repair.
(7), partial hole, the hole wide PAD, can not repair.
(8), the large hole, small hole,
A, a small hole big hole over specification error value. Unrepairable.
(9), VIA BGA's HOLE plugs tin, can not repair.
4, the text part :
(1), text offset , offset text , cover painting to tin pads. Unrepairable .
(2), does not match the text color , text color misprint .
(3), ghost writing , ghost writing acceptable identification, serviceability ,
(4), the text were missing , missing text can not repair.
(5), the text of the ink stains board , marking ink stains board , maintainability ,
(6), the text is unclear, the text is not clear , the impact of recognition . Serviceable .
(7), words fall off, do have 3M600 tape tensile testing , text shedding serviceable .
5 , PAD parts:
(1), the gap pad tin , tin pads or other factors due to scratches caused by the gap , serviceable ,
(2), BGA PAD gap , BGA solder pad portion of the gap , can not repair,
(3), the optical point of poor optical point HAL edges, uneven , causing the paint can not stick or para allowed , resulting in part offset can not repair,
(4), BGA uneven HAL , HAL too thick , beat caused by outside after tin flat , non-repairable ,
(5), the optical point of shedding, shedding non- optical point of repair,
(6), PAD off , PAD off to repair.
(7), QFP not under the ink , can not repair,
(8), QFP Mexican place next fall , QFP fall under the Department of ink acceptance within three have otherwise not be repaired ,
(9), oxidation , PAD contamination and discoloration , maintainability ,
(10), PAD exposed copper , if the BGA or QFP PAD exposed copper , can not repair,
(11), PAD soiled white paint or solder mask with white paint or ink coverage on the PAD, can repair.
6, the other parts:
(1), PCB interlayer separation, white spot, white spots, cannot repair,
(2), textured, plate with woven glass fabric traces, greater than or equal to 10 was not repair,
(3), surface pollution, panel shall have no pressure, fingerprints, grease, resin, adhesive slag, or other external pollution, such as maintenance,
(4), forming size greater than small, shape size tolerance beyond the acceptance standard, the maintenance,
(5), cutting, forming, not completely cannot repair,
(6), thickness, thin plate, the plate thickness of super PCB production specifications, maintenance,
(7), the board become warped, board Chou height is greater than 1.6 mm, not repair.
(8), forming burrs, forming bad cause burrs, plate edge is not smooth, can repair.
Source: //www.seekic.com
