SMD-Stencils are precision tools which have to comply with high requirements, as they take a key role in the SMT (surface mount technology) process. We offer following SMD-Stencils:
Solder paste stencils are used to apply solder depots on printed circuit boards with a screen printing technique. SMD components (SMD = surface mounted device) are placed within these depots subsequently and soldered with a following reflow- or vapor phase process.
Stencils for adhesives are primarily used for mixed assembly, as substitution for a dispenser, and are necessary before component mounting and wave soldering.
Lasered SMD-Stencils (made of stainless steel) allow a precise placement and strenght-of-shape of the solder- / adhesive- depots on the PCB and therefore accomodate the small track-widths and spacings as well as the hightech multipin components.
Terms in this Design-Aid:
top side = squeegee side, top view
bot side = opposite side of squeegee, bottom view
aperture = hole in the stencil, stencil pad
Producible hole diameters
Aspect ratio
The aspect ratio indicates the relationship between the technically producible final diameter depending on the material thickness. Multi PCB can produce aspect ratios up to a maximum of 1:20 (for blind vias 1:1).
Sample aspect ratios
