Q: What is the core technology behind PCB Piezotronics?
A: From its founding in 1967, PCB has specialized in piezoelectric sensors and associated electronics for measurement of dynamic pressure, force, acoustics, and vibration. Our unique expertise was the incorporation of microelectronic signal-conditioning circuitry within these sensors to make them easier to use and more environmentally compatible.
Q: How has this technical focus evolved over the years?
A: Measurement capabilities have expanded to include DC response, variable capacitive, piezoresistive, MEMS, and traditional strain-gage sensing for measurement of load, dynamic strain, torque, acoustics, and pressure. In terms of sensor types, TEDS [transducer electronic data sheets] have become increasingly popular in high-channel-count applications. Our high-temperature accelerometer products have also grown substantially.
Q: What is behind your recent decision to form an automotive division?
A: Increased customer awareness about auto safety and government mandates continues to drive the need for automotive testing. Additionally, with the spread of computer-aided engineering, sensors are increasingly used to test components and complete vehicle prototypes, helping engineers to prove the validity of their computer models. To satisfy customers in this important market, PCB Piezotronics Automotive Sensors division in Novi, MI, is devoted exclusively to R&D, auto component manufacturing, and applications involving vehicle dynamics, crash tests, off highway, motor sports, and engine monitoring.
Q: What other industries are you targeting?
A: Among the major areas are aerospace, defense, equipment protection, worker protection, and environmental noise monitoring. In aerospace and defense, we’re involved in such applications as flight test, health and usage monitoring systems (HUMS), and ground vibration testing. Requirements include sensors that are smaller, lighter, lower profile and, in many cases, designed for high-temperature operation.
Q: What role do customers play in shaping your R&D agenda, and what research areas are you pursuing?
A: Our products are shaped by customer demand and feedback from the outset. The design process at PCB is based around a “design for six sigma” approach. This process involves communicating directly with our customer base to take their general requirements and turn them into specific measurable “critical to customer” (CTC) characteristics. From there, these CTCs are transformed into “product design characteristics,” which the R&D staff uses during the design process.
Current new developments include a significant investment in MEMS technology. In fact, PCB is currently in the process of releasing a high-g shock accelerometer for use in the defense industry. This is our first miniaturized product to be based on the silicon sensing technology. Other current R&D activities include the development of a MEMS crash accelerometer, which is critical to satisfying customer demand in the automotive market.
Investment in high-temperature sensing technology is also a focus area for our R&D team. This includes the development of both accelerometers and pressure sensors for such applications as aircraft engine vibration monitoring, turbine combustion instability measurements, and health monitoring in the power-generation industry.
