1) the IPC - ESD - 2020: electrostatic discharge control program development standard of joint. Including electrostatic discharge control program to design, build, implement and maintain. According to some experience of the military and commercial organizations and for electrostatic discharge processing guide and protect sensitive period.
2) IPC - SA - 61 - A: half water into cleaning manual after welding. Including half water into all aspects of the cleaning, including chemical residue, equipment, production, technology, process control and environmental and safety considerations.
3) the IPC - AC - 62 - a: after welding aqueous cleaning manual. Describe manufacturing residue, the types and properties of aqueous cleaner, water into a cleaning process, equipment and processes, quality control, environmental control and the safety of employees and the cost of the test of cleanliness and.
4) IPC - DRM - 4 0 e: hole weld evaluation desktop reference manual. According to the standard requirements of components, the hole wall and the welding surface covering such detailed description, in addition also includes computer generated 3 d graphics. Covers the complete tin, contact Angle and wetting, vertical filling, welding pad cover and a large number of weld defects.
5) IPC - TA - 722: manual welding technology evaluation. Include all aspects of welding technology of 45 articles, content involves ordinary welding materials, welding, manual welding, batch, wave soldering, reflow soldering, welding the weld and infrared gas phase.
6) the IPC - 7525: template design guidelines. For the solder paste and surface-mount adhesive coating templates provide guidelines to design and manufacture of the I also discussed the application of template design of surface-mount technology, and introduces the hole or flip chip components with you? Kun technology, including overprint, double seal and phase type template design.
7) IPC/EIA J - STD - 004: a flux of the specifications of the demand with appendix I. Contains rosin, resin and other technical indicators and classification, according to the flux of halide content and activation of organic and inorganic flux; Also includes the use of the flux, material containing flux, and no clean process used in the low residual flux.
8) IPC/EIA J - STD - 005: the specifications of the solder paste requirements including appendix I. Lists the characteristics and technical index requirements of solder paste, including test method and the metal content standards, as well as the viscosity, collapse, solder balls, viscosity and wetting properties of solder paste.
9) the IPC/EIA J - STD - 0 6 a: electronic grade solder alloy, flux and the flux of the specifications of the solid solder requirements. For electronic grade solder alloy, bar, strip, powdered flux and the flux of the solder, for the application of electronic soldering, offer special electronic grade solder term name, specification requirements and test methods.
10) IPC - Ca - 821: the general requirements of thermal conductive adhesive. Including the cement components suitable location of the thermal conductivity of the dielectric requirements and test methods.
11) the IPC - 3406: conductive surface coating binder guide. As the solder in the electronic manufacturing alternatives provide guidance for the selection of conductive adhesive.
12) IPC - AJ - 820: assembly and welding handbook. Contains descriptions of assembling and welding inspection technology, including the terms and definitions; printed circuit board, components and pin type, welding point of installation, design specification reference materials, components and outline; Welding technology and packaging; Cleaning and labeling; Quality assurance and testing.
13) the IPC - 7530: batch (reflow soldering and wave soldering) welding process temperature curve guide. Used in the temperature curve to obtain all kinds of test means, technology and methods, in order to establish the best graphics provide guidance.
14) IPC - TR - 460 - a: printed circuit board wave soldering troubleshooting list. For a possible failure caused by wave soldering and recommend a list correction measures.
15) the IPC/EIA/JEDEC J - STD - 003 - a. The weldability test of printed circuit boards.
16) J - STD - 0 13: foot ball lattice grid array (SGA) and other high technology applications. Establish specifications and requirements needed for the printed circuit board assembly process and interaction, for high performance and high pin number integrated circuit packaging interconnection to provide information, including the design principle of information, the choice of materials, the board manufacturing and assembly technology, test method, and based on the reliability of the end-use environment.
17) the IPC - 7095: SGA added device design and assembly process. As is the use of SGA components or consideration to the grid array form the people of this field offers a variety of useful operation information; For testing and servicing of SGA provides guidance and provide reliable information about the field of SGA.
18) IPC - M - I08: wash the instruction manual. Including the latest version of the IPC cleaning instruction, decided to product cleaning process and in manufacturing engineers to help them when troubleshooting.
19) IPC - CH - 65 - A: printed circuit board assembly in the washing instructions. Made in the electronics industry, based on current and new cleaning method for reference, including descriptions of all kinds of cleaning methods and discuss, explained in the manufacturing and assembly operations of various materials, process and the relationship between the pollutant.
20) IPC - SC - 60 a: after welding of solvent cleaning manual. In automatic welding and manual welding is given in the use of solvent cleaning technology, discusses the nature of the solvent, the residue and process control, and environmental issues.
21) IPC - 9201: surface insulation resistance. Surface insulation resistance (SIR) contains the terms, the theory, test process and test means, include temperature, humidity (TH) test, failure mode and troubleshooting.
22) IPC - DRM - 53: electronics assembly desktop reference manual. Used to indicate hole is installed and SMT assembly technology of diagrams and photographs.
23) IPC - M - 103: standard SMT assembly manual. This part includes relevant SMT all 21 IPC file.
24) IPC - M - I04: standard printed circuit board assembly manual. Contains information about the printed circuit board assembly of ten of the most widely used files.
25) IPC - CC - 830 - b: printed circuit board assembly of electronic insulation compounds in performance and appraisal. To protect the conformal coating quality and qualification of an industrial standard.
26) IPC - S - 816: surface-mount technology guide and checklist. The troubleshooting guide lists the SMT assembly of all types of process problems and their solutions, including bridge, leakage welding, component placement arrangement, etc.
27) the IPC - CM - 770 - d: printed circuit board components installation guide. For printed circuit board assembly of components to provide effective guidance, and reviews the relevant standards, the influence and distribution situation, including assembly technology (including manual and automatic and surface-mount technology and flip chip assembly technology) and considering the follow-up welding, cleaning and laminating process.
28) IPC - 7129: the number of breakdown per million opportunities (DPMO) calculation and printed circuit board assembly manufacturing index. For calculating defect and agreed to by the department of quality related industry benchmark; It for calculating per million opportunities down the number of benchmark provides a satisfactory way.
29) : printed circuit board assembly production estimates and per million opportunities for failure in the assembly. Defines the calculating per million opportunities in printed circuit board assembly for the number of the failure of reliable method, is each stage in the process of assembly evaluation criteria.
30) IPC - D - 279: reliable surface-mount technology printed circuit board assembly design guidelines. Surface-mount technology and blending technology of the reliability of the printed circuit board manufacturing process guidance, including design thought.
31) IPC - 2546: the combination of the printed circuit board assembly passed in the points. Describes the material movement system, such as actuators and the placement of buffers, manual, automatic silk screen printing, adhesive automatic distribution, automatic SMT placement, automatic placement of plated through hole, forced convection, and infrared reflow oven and wave soldering.
32) IPC - PE - 740 - a: printed circuit board manufacturing and assembly of troubleshooting. Including printed circuit in the design, manufacture, assembly and testing problems in the process of case histories and calibration activities.
33) IPC - 6010: printed circuit board quality standards and performance specifications series manual. Including the American association of printed circuit board for all printed circuit board quality standards and performance standards.
34) IPC - 6018 - a: microwave finished products inspection and test of printed circuit boards. Including the performance of high frequency (microwave) printed circuit board and eligibility requirements.
35) IPC - D - 317 - a: adopting the technology of high-speed electronic packaging design guideline. To guide the design of high-speed circuits, including mechanical and electrical considerations and performance testing.
