●Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.
UV Blocking/AOI compatible
● HighCTI，CTI≥600V
● Not suitable for solder mask rework
● Consumer electronics
● Smartphone
● Automotive electronics
● Suggested to be used for maximum 8-layer board (thickness<1.6mm) with through hole construction
Product Performance
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 150 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 360 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 36 | |
After Tg | ppm/℃ | 220 | |||
50-260℃ | % | 2.8 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 15 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | pass | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 6.4 x 107 | |
E-24/125 | MΩ.cm | 5.3 x 106 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.8 x 107 | |
E-24/125 | MΩ | 2.8 x 106 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 140 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.010 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.4 | |||
125℃ | N/mm | 1.3 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 | |
CTI | IEC60112 | A | Rating | PLC 0 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 | |||
1. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.
2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
Product Certificate
CQC S1151G S.pdf
Data Download
S1151G TDS
S1151G Line up
S1151G Processing guidelines
S1151G Laminate SGS
S1151G Prepreg SGS
S1151G Laminate MSDS
S1151G Prepreg MSDS
