● Polyimide system provides ultra-high thermal performance, with Tg＞250℃ (TMA), Td＞405℃ (5% loss, TGA), and T300＞60min.
● Lower Z-axis CTE of1.20% (50-260℃) offering superior PTH reliability.
● Maintain mechanical strength and bonding strength at high temperature.
● Tough resin system, Non-MDA chemistry.
● Halogen-free chemistry compatible with lead-free processing. RoHS/WEEE compliant.
● IPC4101D/40,/41.
● Burn-in Board
● Down Hole
● Aircraft and Aerospace
● Other PCB requirements to work under high temperature in long time
Product Performance
1. Specimen thickness: 1.6mm (Electrical Strength and Young's Modulus Specimen thickness 0.1mm). Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only. Please turn to Shengyi Technology Co., Ltd. for more detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
3. Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
SH260 TDS
SH260 Line up
SH260 Processing guidelines
SH260 Laminate SGS
SH260 Laminate MSDS
SH260 Prepreg MSDS
