HSD Materials,Mid-loss Material
● Tg＞190℃ (DSC)
● Dk/Df@1GHz: 3.62/0.0085
● low Z-axis CTE, with good processibility
PC server, line card, HSD application...
Product Performance
Items
Method
Condition
Unit
Typical Value
Tg
IPC-TM-650 2.4.25
DSC
℃
190
Tg
IPC-TM-650 2.4.24.4
DMA
℃
200
Td
IPC-TM-650 2.4.24.6
5% wt. loss
℃
345
CTE（Z-axis）
IPC-TM-650 2.4.24
Before Tg
ppm/℃
50
After Tg
ppm/℃
230
50-260℃
%
2.5
T260
IPC-TM-650 2.4.24.1
TMA
min
>60
T288
IPC-TM-650 2.4.24.1
TMA
min
27
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
--
PASS
Dissipation Constant (Dk)
IPC-TM-650 2.5.5.9
1GHz
--
3.8
IPC-TM-650 2.5.5.5
10GHz
--
3.62
IEC 61189-2-721
10GHz
--
3.92
Dissipation Factor (Df)
IPC-TM-650 2.5.5.9
1GHz
--
0.0070
IPC-TM-650 2.5.5.5
10GHz
--
0.0085
IEC 61189-2-721
10GHz
--
0.0087
Peel Strength(1oz RTF copper foil)
IPC-TM-650 2.4.8
After thermal Stress 288℃,10s
N/mm
1.1
Water Absorption
IPC-TM-650 2.6.2.1
E-1/105+D-24/23
%
0.08
Flammability
UL94
C-48/23/50
Rating
V-0
E-24/125
Rating
V-0
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in℃and the third digit the relative humidity.
Data Download
S7038 Line up
S7038 Processing guidelines
S7038 Laminate SGS
S7038 Prepreg SGS
S7038 Laminate MSDS
S7038 Prepreg MSDS
S7038 TDS
