The force perpendicular to a board’s surface required to separate two adjacent layers of the board, expressed as&nb...
Shiny Li
Jan 19,2016
550 views
A failure condition in which a lead is separated from its bonding surface.
Shiny Li
Jan 19,2016
558 views
The common area between a lead and a land to which it has been terminated.
Shiny Li
Jan 19,2016
442 views
The portion of an electronic component exclusive of its pins or leads.
Shiny Li
Jan 19,2016
555 views
The overall thickness of the base material and all conductive materials deposited thereon.
Shiny Li
Jan 19,2016
563 views
A measure of the ratio of the area of the board used by parts to the total available area of the&nbs...
Shiny Li
Jan 19,2016
499 views
An external layer of resin over the reinforcing structure of base material.
Shiny Li
Jan 19,2016
719 views
Bluetooth is a short-range (up to 10m) 2.4GHz wireless connectivity standard intended for such applications as wireless&...
Shiny Li
Jan 19,2016
593 views
A void in the solder fillet caused by outgassing from the barrel of a plated through hole.(see also outgassing...
Shiny Li
Jan 19,2016
511 views
A localized swelling and separation between any of the layers of a laminated base material, or between base ma...
Shiny Li
Jan 19,2016
1098 views
De-lamination in the form of a localized swelling and separation between any of the Layers of a lamination bas...
Shiny Li
Jan 19,2016
632 views
A via that reaches only one layer beneath the outer layer on one side of a muti-layer board.
Shiny Li
Jan 19,2016
705 views
A condition in which liquid solder resist or rotation spreads larger than the defined apperture.
Shiny Li
Jan 19,2016
659 views
Ball Grid Array. Leadless array packaging technology in which solder balls are mounted to the underside of the ...
Shiny Li
Jan 19,2016
568 views
A connector contact which is a flat sprint folded to provide a uniform spring rate over the full tolerance ran...
Shiny Li
Jan 19,2016
530 views
A method of PCB testing involving a fixture containing a field of spring-loaded pins that are co-ordinated with&nbs...
Shiny Li
Jan 19,2016
664 views
The ease with which a metal or metal alloy can be wetted by molten solder.
Shiny Li
Jan 19,2016
608 views
The ease with which a metal or metal alloy surface can be wetted by molten solder under minimum realistic ...
Shiny Li
Jan 19,2016
450 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | _ Floppy Lab | 4 |
| 2 | PCBWay Team | 3 |
