The distance between the edge of a conductor and the edge of a supported or unsupported hole.
Shiny Li
Jan 20,2016
535 views
The thickness of the conductor at any point chosen at random on the printed board, normally viewed from vertically above unless otherwise specified.
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Jan 20,2016
477 views
The average or minimum (as specified) distance between the adjacent edges of conductors on the same layer of a printed board.
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Jan 20,2016
475 views
The side of a single-sided printed board containing the conductive pattern.
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Jan 20,2016
613 views
The total conductive pattern formed upon one side of a single layer of base material.
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Jan 20,2016
441 views
The conductor width at the plane of the surface of the base material. See also: Conductor width.
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Jan 20,2016
484 views
The configuration or design of the conductive material on the base laminate. Includes conductors, lands, and through connections.
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Jan 20,2016
489 views
A thin sheet of metal that may cover one or both sides of the base material and is intended to form the conductive pattern.
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Jan 20,2016
595 views
A material to which metal particles (usually silver ) are added to increase electrical conductivity.
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Jan 20,2016
466 views
Any of the basic parts used in building electronic equipment, such as a resistor, capacitor, DIP or connector, etc.
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Jan 20,2016
427 views
(Primary side) The surface layer of a board on which most of the components are placed. Component side is also referred to as the top side (layer one-counting downwards) of the board.
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Jan 20,2016
411 views
A hole in a PCB through-which a component lead passes in order to be soldered or connected mechanically to the printed circuit and electrically to the conductive pattern. Synonym: mounting hole....
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Jan 20,2016
444 views
The quantity of components on a unit area of printed board.
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Jan 20,2016
410 views
A software module that analyses and converts programs from a high-level language to binary machine codes.
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Jan 20,2016
463 views
In which materials can be mixed or brought into contact with no reaction or separation.
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Jan 20,2016
620 views
A solder connection that exhibits poor wetting and that is characterized by a greyish porous appearance.
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Jan 20,2016
557 views
The fractional change in dimension of a material for a unit change in temperature expressed in ppm/C.
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Jan 20,2016
530 views
Chip on board. Component packaging technology in which bare integrated circuits are attached directly to the surface of a substrate and interconnected to the substrate most often by means of microscop...
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Jan 20,2016
661 views
A thin layer of material, either conductive or insulating, applied over components or base materials.
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Jan 20,2016
464 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | _ Floppy Lab | 4 |
| 2 | PCBWay Team | 3 |
