The property of a fluid that enables it to develop and maintain a level of shearing stress dependent upon the velocity of flow and then offer continued resistance to flow. The absolute unit of viscosi...
A virtual (computer model) representation of an electronic product that can be used to explore different design scenarios and then verify that the product will work as planned before building a physic...
A plated through-hole used as an interlayer connection and not as a terminating point for a component lead. It may also be blind (incomplete penetration) or buried (non-surfacing).
A plated through-hole whose only purpose is to connect a track on one layer or side of the board through to a track on another layer or side. In a via, there is no intention to insert a component lead...
The solder re-flow process that uses a vaporized solvent as the source for heating the solder beyond its melting point,creating the component-to-board solder joint.
A component handling tool with a small vacuum cup for ease of pick-up and removal during de-soldering.
A logotype authorized for placement on a product which has been recognized (accepted) by Underwriters Laboratories, Inc. (UL).
Fluxless soldering wherein molten solder is vibrated at ultrasonic frequencies while making the joint.
Underwriter’s Laboratories, Inc., a corporation for the purpose of establishing safety standards on types of equipment or components in USA and Canada.
The deformation of a rectangular sheet, panel or printed board, that occurs parallel to a diagonal across its surface in such a way that one of the comers of the sheet is not in the plane formed by th...
Dielectric material with higher glass transition temperature and better thermal stability than epoxy resin, however, more expensive and not in common use.
A signal-carrying circuit composed of conductors and dielectric material with controlled electrical characteristics used for the transmission of high-frequency or narrow-pulse type signals.
The metallic conductive strips that provide connections between components, terminals, etc., on printed circuits.
A soldering defect in which a chip component moves into a vertical position during solidification of the solder so that only one terminal is connected. It is caused by defective re-flow processing.
Ranking | Name | Answers |
---|---|---|
1 | _ Floppy Lab | 4 |
2 | PCBWay Team | 3 |