What is OSP?
OSP stands for Organic Solderability Preservative, which is a process of PCB copper surface treatment that meets the RoHS requirements. Simply put, OSP is to chemically generate an organic film on the clean bare copper surface. This layer of film has anti-oxidation and moisture resistance to protect the copper surface from being oxidized or sulfuretted in a normal environment.
One thing needs to be noted is that the OSP layer is extremely sensitive to handling and can easily retain scratches, which can degrade its solderability.
It uses water-based organic compound that selectively bonds to copper and protects the copper until soldering, so it’s very environment-friendly and also cost-effective.
In short, OSP can be used as an effective alternative to lead-free HASL. When you need a PCB surface finish that can provide sufficient flatness and simple manufacturing process, OSP can be a good choice for you.
