We are currently working on an HDI PCB design that incorporates 0.1mm blind laser-drilled microvias, including stacked microvias that traverse more than one layer. To ensure compatibility with your manufacturing capabilities, we would like to confirm whether your facility can support the fabrication of such advanced PCB features. Specifically, we require high-quality manufacturing processes, including laser drilling for 0.1mm microvias, to meet the design requirements. Could you kindly verify if this is feasible within your production environment? Your confirmation will help us proceed accordingly. Thank you for your assistance.
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