Suggestion for 300 um pitch BGA

Engineer asked Feb 14,2025
0

Hi

We need to design a PCB with a 300um pitch BGA component. Please have a look at the attached image showing the footprint of the component.


Question:

What approach do you suggest to fan out all signals, what PCB specifications do we need?


PCB specifications:

  • Number of layers: 4
  • Thickness: 1 mm
  • Blind vias: yes
  • Via in pad: yes
  • Dimensions: 25 x 28 mm


Thanks for your help & best regards

Rashid

  • Your Answer(1)
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    You may try below options:
    1. Microvias & Blind Vias
    2. Via-in-Pad (VIP)

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