Conductor Side

The side of a single-sided printed board containing the conductive pattern.

Conductor Side

Conductor Pattern

See “Conductive Pattern ”.

Conductor Pattern

Conductor Layer

The total conductive pattern formed upon one side of a single layer of base material.

Conductor Layer

Conductor Base width

The conductor width at the plane of the surface of the base material. See also: Conductor width.

Conductor Base width

Conductive Pattern

 The configuration or design of the conductive material on the base laminate. Includes conductors, lands, and through connections.

Conductive Pattern

Conductive Foil

A thin sheet of metal that may cover one or both sides of the base material and is intended to form the conductive pattern.

Conductive Foil

Conductive Adhesive

A material to which metal particles (usually silver ) are added to increase electrical conductivity.

Conductive Adhesive

Component

Any of the basic parts used in building electronic equipment, such as a resistor, capacitor, DIP or connector, etc.

Component

Component side

(Primary side) The surface layer of a board on which most of the components are placed. Component side is also referred to as the top side (layer one-counting downwards) of the board.

Component side

Component Hole

A hole in a PCB through-which a component lead passes in order to be soldered or connected mechanically to the printed circuit and electrically to the conductive pattern.  Synonym: mounting hole....

Component Hole

Component Density

The quantity of components on a unit area of printed board.

Component Density

Compiler

 A software module that analyses and converts programs from a high-level language to binary machine codes.

Compiler

Compatibility

In which materials can be mixed or brought into contact with no reaction or separation.

Compatibility

Cold Solder Connection

 A solder connection that exhibits poor wetting and that is characterized by a greyish porous appearance.

Cold Solder Connection

Coefficient of Expansion, Thermal-CTE

 The fractional change in dimension of a material for a unit change in temperature expressed in ppm/C.

Coefficient of Expansion Thermal-CTE

COB

Chip on board. Component packaging technology in which bare integrated circuits are attached directly to the surface of a substrate and interconnected to the substrate most often by means of microscop...

COB

Coating

A thin layer of material, either conductive or insulating, applied over components or base materials.

Coating

Clinched-wire through Connection

 A connection made by a wire which is passed through a hole in a printed circuit board, and subsequently formed, or clinched, in contact with the conductive pattern on each side of the board, and...

Clinched-wire through Connection

Clearance

Metal to metal gaps on a board.

Clearance

Clearance Hole

A hole in the conductive pattern larger than, but concentric with, a hole in the printed board base material.

Clearance Hole

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