A heavy trace or conductive metal strip on the printed circuit board used to distribute voltage, grounds, etc., to smaller branch trances.
Shiny Li
Jan 20,2016
508 views
A conduit, such as a conductor on a printed board, for distributing electrical energy.
Shiny Li
Jan 20,2016
648 views
A method of testing devices via electrical stress vs temperature and/or time so that units prone to failure are eliminated.
Shiny Li
Jan 20,2016
509 views
A via that does not reach a surface layer on either side of a multi-layer board. The via transcends only inner layers of the board.
Shiny Li
Jan 20,2016
564 views
A swelling of a printed board that is usually caused by internal de-lamination or separation of fibres.
Shiny Li
Jan 20,2016
1323 views
( prepreg ) Partially cured resin ( mostly reinforced with glass cloth ) which will soften under a special&nbs...
Shiny Li
Jan 19,2016
1331 views
A resin in an intermediate state of cure. The cure is normally completed during the laminating cycle.
Shiny Li
Jan 19,2016
726 views
A condition where excess solder builds up in the air gap between conductors and causes them to short together....
Shiny Li
Jan 19,2016
666 views
Solder that spans across two or more conductors causing an electrical short-circuit.
Shiny Li
Jan 19,2016
486 views
The voltage at which an insulator or dielectric ruptures or at which ionization and conduction take place in a...
Shiny Li
Jan 19,2016
597 views
A metal alloy (solder) which melts above 450℃ but below metals being joined.
Shiny Li
Jan 19,2016
444 views
A conductor which connects electrically two or more leads on a printed board assembly. Some branched conductors, no...
Shiny Li
Jan 19,2016
505 views
The deviation from the flatness of a board characterized by a roughly cylindrical or spherical curvature. If the&nb...
Shiny Li
Jan 19,2016
481 views
A self-test designed into components at the silicon level, permitting testing via a built-in, four-or-five-pin test bus&...
Shiny Li
Jan 19,2016
590 views
Patterns that appear in the border area, such as tooling features, test patterns and registration marks.
Shiny Li
Jan 19,2016
468 views
The duration from hot-bar-heat-up (contact with lead and pad ) until the solder joint is completed.
Shiny Li
Jan 19,2016
495 views
An adhesive layer used in bonding together other discrete layers of multi-layer printed board during lamination.
Shiny Li
Jan 19,2016
1109 views
The force perpendicular to a board’s surface required to separate two adjacent layers of the board, expressed as&nb...
Shiny Li
Jan 19,2016
562 views
A failure condition in which a lead is separated from its bonding surface.
Shiny Li
Jan 19,2016
576 views
The common area between a lead and a land to which it has been terminated.
Shiny Li
Jan 19,2016
456 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 6 |
| 2 | Engineer | 1 |
| 3 | Stephen Newport | 1 |
