PCB Basic Information

The Formation and Prevention of Black Pad and Phosphorus-Rich Layers

In our daily SMT soldering operations, we often find that ENIG surface-treated boards are prone to two fatal problems: nickel corrosion and phosphorus-rich layers. Once such problems occur, they often...

black pad phosphorus-rich layer SMT ENIG

PCB Assembly

Advantages and Disadvantages of Surface Mounting Technology

Introduction:Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).&nbsp...

SMT

PCB Assembly

PCB Requirements for Typical SMT Equipment

Introduction:There are many types of SMT equipment. How to make the design of PCB meet its requirements is decided by the type of equipment. The basic requirements of typical SMT equipment to PCB in C...

SMT

PCB Assembly

The Main Factors Affect the Quality of SMT Soldering and Its Solutions

Abstract: SMT process as the core of the electronic assembly process, the welding quality affects the overall quality of the products. For SMT industry, high quality welding quality is the basis of pr...

SMT Solder paste Stencil 3. Scraper Reflow Welding

PCB Manufacturing Information

Organic Solderability Preservative (OSP)

—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also deve...

Organic Solderability Preservative (OSP) SMT

PCB Assembly

Something You Must Know about Surface Mount Technology (SMT)

Introduction:Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).&nbsp...

PCB PCB Assembly SMT Surface-mount technology

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