ENIG vs. Hard Gold Plating

In the PCB manufacturing process, selecting the appropriate surface finish is crucial to the performance and reliability of the circuit board. Among these, Electroless Nickel Immersion Gold (ENIG) and...

ENIG Hard Gold Plating Surface Finish

Solution for Copper Base Discoloration After High-Temperature Furnace: OSP Treatment

In the manufacturing process of copper base PCB, the discoloration of the copper base, which acts as a heat conductor, due to oxidation has always been a significant challenge. During production, if t...

Copper Base OSP PCB

How should the solder mask color be chosen for color-printed PCBs?

In the process of manufacturing colored printed circuit boards (PCBs), the choice of solder mask color is crucial as it directly relates to the realization of design intentions and the creation of vis...

Color PCB Printing UV Printing Solder Mask

Factors that Influencing Prices for PCB Manufacturing and Assembly

In electronic manufacturing, PCBs are vital parts. However, the cost of their manufacturing and assembly is influenced by various factors. From size and materials to specific manufacturing processes u...

PCB Cost PCB Manufacturing and Assembly

Reasons to Choose SYTECH-S1000H

Choosing the appropriate base material is crucial for the performance and reliability of electronic products. Among the numerous options available, the SYTECH S1000H TG150 board is gaining more and mo...

PCB Material TG150 FR4 S1000H

What is a Fiducial Mark? | PCB Knowledge

What is a Fiducial Mark and How Does it Work?A fiducial mark is typically a circular pad or other shapes of exposed copper that is surrounded by a clearance area. It acts as a reference point for auto...

FQC and Packaging | Multi-layer PCB Manufacturing Process - 16

Final Quality ControlFQC, short for final quality control, is the comprehensive and final inspection of printed circuit boards before shipping to ensure that the boards meet the specifications. Althou...

PCB Manufacturing

Electrical Test | Multi-layer PCB Manufacturing Process - 15

After all the manufacturing processes of the circuit board have been completed, the electrical test is carried out to check the board for open circuits and short circuits. The two most commonly used t...

PCB Manufacturing

Profile | Multi-layer PCB Manufacturing Process - 14

The process of PCB profile is to cut the production panel into specific sizes and shapes based on the customer's design requirements. To facilitate PCB assembly, the boards can be profiled in individu...

PCB Manufacturing

Surface Finish | Multi-layer PCB Manufacturing Process - 13

Bare copper of PCB is easily oxidized by moisture when exposed to air, and the resulting oxide layer of copper has a great impact on the soldering, which may lead to cold soldering and even cause the ...

PCB Manufacturing

Legend Printing | Multi-layer PCB Manufacturing Process - 12

Legend printing ,also known as Silkscreen, is a process of printing informational texts or patterns on the surface of the board. Legend information includes component reference designators, switch set...

PCB Manufacturing

PCB Surface Finishes

Bare copper has good solderability, but it is easily oxidized by moisture when exposed to air. The oxide layer of copper has a great impact on the soldering. It may lead to cold soldering and even cau...

PCB Manufacturing

Soldermask | Multi-layer PCB Manufacturing Process - 11

As a protective layer, the solder mask layer is covered on the traces and substrates that do not need to be soldered to prevent short circuits during soldering. At the same time, it serves to provide ...

PCB Manufacturing

Automatic Optical Inspection | Multi-layer PCB Manufacturing Process - 10

AOI - Automatic Optical InspectionDuring the etching process, the etching method, the etching rate, the types and pH value of the etchants, or other factors directly affect the quality of the circuits...

PCB Manufacturing

Etching | Multi-layer PCB Manufacturing Process – 09

In the previous step, the copper surface is covered with a layer of tin as an etching resist. Now we need to remove the unwanted copper from the surface to obtain the final desired circuits. This proc...

PCB Manufacturing

Pattern Plating | Multi-layer PCB Manufacturing Process - 08

After developing, the copper thickness of the exposed circuits needs to be increased by a secondary copper plating, namely pattern plating. The purpose is to make the hole copper and surface copper of...

PCB PCB Manufacturing

Outer Layer | Multi-layer PCB Manufacturing Process - 07

In the previous steps, we have completed the creation of all the inner layer circuits and the required holes (Through/Buried/Blind holes). Next, we have to enter the outer layer imaging process of the...

PCB Manufacturing

PCB Plating Process | Multi-layer PCB Manufacturing Process - 06

The hole walls after drilling are composed of non-conductive epoxy resin and fiberglass board. In order to connect circuits between different layers, it is necessary to metalize the hole walls through...

PCB Manufacturing

Drilling | Multi-layer PCB Manufacturing Process - 05

To make the circuit of each layer connected, the boards need to go through the drilling process to make the corresponding holes according to the specifications in the drill files. For single and doubl...

PCB Manufacturing

Lamination | Multi-layer PCB Manufacturing Process - 04

Prior to lamination, the surface of inner image layer needs to go through an oxide process (brown oxide or black oxide treatment) to roughen and passivate the copper surface, increase the interaction ...

PCB Manufacturing

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