Keyword: quantities of PCB, circuit board, PCB supplier
Because HDI board to adapt to the high integration of IC and high-density interconnect assembly on the development of the technology, it put the PCB manufacturing technology on the new step, and become one of the biggest hot PCB manufacturing technology! In the production of all kinds of PCB CAM, engages in the production of CAM researchers agree that cell phone HDI board shape is complex, high density of wiring and CAM manufacture is difficult, it is difficult to quickly and accurately finish! Facing the customer high quality, quick delivery requirements, myself through constant practice, the summary, have a little experience, that I'd like to share with you CAM.
A. How to define the SMD is produced by the CAM first difficulty.
In the process of PCB production, graphic transfer, etching factors will affect the final pattern, so we according to the customer's acceptance criteria in the CAM manufacture, compensate for lines and SMD, respectively, if we have no correct definition SMD, finished product may appear small part of the SMD. Customers often in HDI mobile phone board design 0.5 mm of CSP, the pad size of 0.3 mm, and in some CSP welding plate cloth has a blind holes, blind holes corresponding to the pad is 0.3 mm, just make the CSP welding plate and blind holes corresponding to the welding plate overlap or cross together. Such a case must be careful operation, guard against errors. For genesis2000 (for example)
Specific steps:
1. Buried blind hole, hole corresponding to the drilling layer closure.
2. Define the SMD
3. Use FeaturesFilterpopup and Referenceselectionpopup function, find out from the top layer and bottom layer include blind hole of bonding pad, movetot layer a and b, respectively.
4. In the t (CSP solder layer) using Referenceselectionpopup function, choose and blind holes of 0.3 mm Touch pad and delete, the top layer of CSP area of 0.3 mm of bonding pad is deleted. According to customer design the size of the CSP solder, position, number, make a CSP, and defined as SMD, copies the CSP solder and then to the TOP layer, and combined with blind holes in the TOP layer of the welding plate. B layer made similar methods.
5. Control provide steel mesh file to find out other definition or definition of SMD.
Compared with the conventional production methods, purposeful, less steps, this method can avoid the wrong operation, fast and accurate!
B. Without function welding plate is a special procedure of HDI mobile phone board.
In ordinary eight HDI, for example, the first thing to remove the hole in the 2-7 layer corresponding nonfunctional solder, then should also remove 2-7 buried holes in the 3-6 layer corresponding nonfunctional welding plate.
Steps are as follows:
1. In NFPRemovel function to remove the top and bottom layer of non-metallic hole corresponding to the welding plate.
2. Close all the drilling layer, in addition to the hole RemoveundrilLEDpads NFPRemovel function in the select NO, remove 2-7 layer nonfunctional welding plate.
3. Close except 2-7 layer buried all outside the hole drilling, Removeundrilledpads NFPRemovel function in the select NO, remove 3-6 layer nonfunctional welding plate.
In this way without bonding pad function, clear, easy to understand, the most suitable for just that engages in the production of CAM.
C. About the laser into a hole:
HDI mobile plate of the blind hole is 0.1 mm or so commonly microporous, our company adopts CO2 laser, organic material can strongly absorb the infrared, through the thermal effect, the ablation into hole, but copper on infrared absorption is very small, and the melting point of copper is tall, CO2 laser can't ablation copper foil, so use "conformalmask" process, with a copper etching liquid etched away laser drilling (CAM production exposed hole film). At the same time to ensure that the outer layer (laser into the bottom of the hole) for copper, blind and buried hole spacing should be at least more than 4 mil, therefore, we must use the Analysis/Fabrication/Board - Drill - Checks find hole location does not meet the conditions.
D. Jack and resistance welding:
On laminated configuration, HDI outer generally adopts RCC materials, the medium thickness thin, small amount of gel and the process experiment data show that if you have finished product thickness is greater than 0.8 mm, metallic tank mmX2.0 greater than or equal to 0.8 mm, metallized hole is greater than or equal to 1.2 mm, one of the three must do two sets of plug hole file. The two plug hole, the inner level the plug hole with resin, outer with solder resist ink directly in front of the resistance welding plug hole. In the process of resistance welding production, often have a hole on the SMD or next to SMD. All customer requirements via do plug hole processing, resistance welding show or when solder resist exposure so revealing half a hole via oil prone. CAM staff must be processed to this, we generally preferred move the hole, if unable to move the hole, then follow these steps:
1. To be a distributed resistance welding Covered Windows, in resistance welding layer and smaller than the finished hole unilateral 3 mil pervious to light.
2. Will open a window and resistance welding Touch a distributed, in resistance welding layer plus 3 mil is bigger than the finished hole unilateral pervious to light. (in this case, the customer to allow a little ink pad)
E. Shape:
HDI phone board is commonly makeup delivery, appearance is complex, the customer with a CAD drawing of makeup. According to customer's drawings marked, if we use genesis2000 for drawing, very trouble. *. We can put the CAD file format DWG directly click on the "save as" in the file will be save the type is changed to "AutoCADR14 / LT98 / LT97DXF (*. DXF)" and then the normal way read genber file read *. DXF file. Read again in reading shape at the same time, the stamp hole, positioning hole and optical anchor point size, location, quick and accurate.
F. Milling shape frame processing:
Processing and milling shape frame, unless the customer request in CAM make necessary dew copper, copper sheet in order to prevent edge, according to the production specification, cut A little copper requirements on the border to the plate and therefore hard to avoid can appear as shown in figure 2 in A case! If A does not belong to the same network on both ends, and the copper sheet width is less than 3 mil (might do not graphics), will cause the open circuit. In the analysis of genesis2000 see such problem, so must be another way. We can do more A network, and the second is, the more copper by the border to the plate cutting 3 mil, if there is no open circuit, comparison results show that both ends of A belong to the same network or width is greater than 3 mil (graphics) can be made. If there is open circuit, will widen the copper sheet.
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