SMT or surface mount technology is the revised, improved and a better concept derived from Through-Hole technique of PCB manufacturing. This technology has made the entire procedure of this electronic manufacturing segment more streamlined and easier. Now it no longer requires drilling of holes on the PCB to mount the components. Instead of drilling, now manufactures use a paste for mounting purpose that function as adhesives.
Although SMT technology lacked a few of the strength factors that through-hole mounting offered, but the ability that it offered to PCB manufacturing companies by allowing them to place multiple components on a small surface totally outweighed those trivial disadvantages.
Modern SMT manufacturing and production is extremely streamlined procedure and requires one time set up. Briefly discussed below are the five stages that fall under surface mount technique.
Once the PCB is created with solder points and circuit laid out, solder paste is used to solder each point on the board.
Printers that look like silk screen perform the function of depositing the solders on the pads which then join the parts and components on the board.
A machine meant for picking and placing accurately applies the components to the designated solder points.
Soldering ovens are used to combine the PCB at right temperate so that solder points get hardened into the right state without causing any damage to the surrounding components.
The last stage is when professionals visually inspect the board via AOI (automated optical inspection), to check for any flaws or deformities.
