With increasingly sophisticated consumer electronics products , as such products as the carrier board increasingly sophisticated consumer electronics products , such products as carrier board PCB board has become increasingly sophisticated, more and more fine lines .
In the development of PCB backlight system , the heat is a very important issue , because the current in glowing LED will also produce more heat, and the heat will severely affect these .
In order to improve the performance of light-emitting LED backlight system thermal performance PCB , two aspects to consider: improving the thermal performance of single LED . Improve the thermal performance of the LED array .
PCB board as a backlight system designers, we chose the second solution to solve the heat problem. To improve the heat dissipation performance of the LED array systems . Cooling method : using a fan to increase air flow rate around the backlight system . Reduced from junction to ambient thermal resistance . The backlight module design in outstanding economic performance thermal heat dissipation substrate printed circuit board is a better solution.
Currently widely used conventional polymer insulated metal substrate (IMS) technology uses a polymer or an epoxy resin as the insulating material layer , this technique requires a special surface treatment of the metal base , and the minimum thickness of the insulating layer is about 75 microns , this will increase the thermal resistance of the entire insulated metal substrate. In addition, traditional IMS technology will produce at a high temperature insulating layer and the metal substrate stratification.
PCB circuit boards with plasma magnetron sputtering process is limited to the area near the target material , will not damage the film is being formed . Electron movement distance becomes longer , increasing the probability of ionization of the argon atoms , which means that more targets are bombarded atoms out , thereby improving the efficiency of the sputtering process . Impurities in the film produced by sputtering the minimum guaranteed quality of the film .
Anodic oxide insulating layer is formed through a special porous structure anodizing the pore structure determines its electrical insulation properties. Depending on the processing technology, the electric strength reaches 250V to 3000V. By drawing the line lithography mask technology in this layer . This design implements seamless base layer and an insulating layer.
PCB circuit board is connected directly to the floor , which makes chips, printed circuit board and heat sink to form a unified whole , significantly improve the thermal performance of the circuit board .
PCB circuit boards in the development process among backlight system , heat is a very important issue to achieve a new kind of aluminum insulation board and propose an improved method for measuring electrical parameters of thermal resistance . Relative to conventional polymer-insulated metal base circuit board , the aluminum anodic oxide insulating board has the following advantages in the circuit board between the anode and the aluminum oxide insulating layer is no mechanical connection grass gap improves the overall mechanical properties of the board .
PCB board metallization layer in three-layer film using a magnetron sputtering technique to produce and can provide a binding force of at least 1000N/cm2 , it also improves the overall mechanical properties of the board . The new circuit board to reduce the number of layers of a conventional circuit board , reducing the thickness of the insulating layer , so that the entire board reduces thermal resistance than the conventional wiring board of 59.2% .
