Generally , the distribution of copper plate board on the line is very complicated , difficult to accurately modeled. Therefore, the need to simplify the modeling of the shape of the wiring , to make possible the electronic components on the plate board ANSYS model circuit plate board close to the actual line and can be applied to simplify the simulation model , such as the MOS transistor, integrated circuit and the like.
1. Thermal Analysis
Thermal analysis can help designers to determine the circuit board
In many applications, the weight and physical size is very important , if the actual power consumption of components is very small, could result in safety factor is too high , so that the circuit board design uses inconsistent with the actual power consumption of components or overly conservative values as a basis thermal analysis . In contrast (and more serious ) is the thermal design safety factor is too low , that the temperature of the actual run-time components than analysts predicted to be high, such problems generally through the installation of heat sink or fan on board cooled to resolve. These external accessories increased costs, and extend the production time , adding to the reliability of the design of the fan will bring instability , and therefore the main circuit plate board with active rather than passive cooling methods ( such as natural convection, conduction and radiation cooling ) .
2. line plate board simplifies modeling
Modeling circuit plate board before the main heating device which, like MOS transistor and integrated circuit blocks , these elements at work most of the power loss into heat . Therefore , when modeling these devices need to be considered major . Also, consider the circuit board substrate , as copper wire coating . They not only play the role in the design of electrically conductive, but also serves to conduct heat , the thermal conductivity and the heat transfer area is larger than the electronic circuit plate board line integral part of its structure consists of an epoxy resin substrate and as a copper wire coating composition . Epoxy substrate thickness is 4mm, the thickness of the copper foil of 0.1mm. The thermal conductivity of copper 400W / (m ℃), the thermal conductivity of the epoxy resin was only 0.276W / (m ℃). Despite the increase of thin copper foil is very thin , but then there is a strong role in guiding the heat , and therefore can not be ignored in the modeling .
