A century, mankind has entered a highly information-oriented society, in the PCB in the information industry is a major pillar of the indispensable.
Electronic equipment requirements of high-performance, high-speed short and thin, and as a multidisciplinary industry - high-end electronic equipment PCB is the most critical technologies. PCB products regardless of rigid, flexible, just - Multilayer Flexible, as well as the substrates for IC package substrate modules for high-end electronic equipment made tremendous contributions. PCB interconnect technology in the electronic industry occupies an important position.
One along the high-density interconnect technology (HDI) on the development of road.
The HDI PCB concentrated expression of the most advanced technology, it brought to the PCB fine wire, the small aperture. Multilayer HDI terminal application of electronic products - mobile phones (mobile phones) is the forefront of the technological development of HDI model. In the phone PCB board micro-wire (50 μ m ~ 75 μ m/50 μ m ~ 75 μ m, wire width / spacing) has become mainstream, and conductive layer, the thickness of the thin conductive graphics Fine, bring high-density electronic equipment, high-performance of.
2, the components buried embedded technology has strong vitality
PCB formed in the inner semiconductor device (called active components), and electronic components (called passive components), or passive components function "buried containing PCB component" of mass production, technical components buried inlay PCB is functional integrated circuits in the world, but must be addressed to develop analog design, production technology and quality inspection, reliability assurance is a priority.
3, the development of materials in the PCB to a higher level
Either rigid or flexible PCB materials, as the global electronic products lead-free, we must make higher heat resistance of these materials, new high Tg, the coefficient of thermal expansion of small, medium small constant, dielectric loss tangent at the continuous emergence of good material .
4, optoelectronic PCB broad prospects
It uses optical layer and layer circuit transmission signal, this new technology is the key to creating optical path layer (waveguide layers). It is an organic polymer, using lithography photocopying, laser ablation, such as reactive ion etching method to form. At present the technology in Japan and the United States, has been industrialized.
5, manufacturing technology to be updated, it is necessary to introduce advanced equipment
1. Manufacturing Process
HDI has matured and manufacturers tend to improve, with the PCB technology, commonly used in the past by Chengfa manufacturing methods still dominant, but Addition and semi-additive method, such as low-cost technology has begun to spring up.
Using nano-technology at the same time of the formation of metal-PCB graphics conductive plate of the new flexible manufacturing methods.
High-reliability, high-quality printing method, inkjet PCB technology.
2. Advanced equipment
Production fine line, the new high-definition optical mask and exposure to the laser devices, as well as direct exposure device.
Uniform coating equipment.
Buried inlay production components (Active Passive components) manufacturing and installation of equipment and facilities.
