Keyword: PCB design, PCB manufacture, board manufacturing technology
PCB design basic technological requirements
1.1 PCB manufacture basic process and the current level *
PCB design is best not to surpass the manufacturer when the mass production can reach the level of technology, otherwise will not be able to process or high costs.
1.1.1 laminated composite board process
Laminated composite board technology is currently widely used composite board manufacturing technology, it is making the circuit layer, using the method by laminating, mechanical drilling, chemistry sink copper, copper plating technology make each layer circuit to realize interconnection, the spray coating resistance welding flux, tin, screen printing characters complete multilayer PCB manufacturing. At present domestic main manufacturers of technological level as listed in table 3.
1.1.2 'moom' means' * (horizon laminated) process
'moom' means' board (Build - up multilayer PCB), is a traditional craft manufacture in the inner core rigidity, and on one side or both sides to horizon higher density interconnect a layer or two, for a maximum of four layers, the biggest characteristic of 'moom' means' board is the product layer is very thin, line width, line spacing and the conduction of small aperture and interconnection density is very high, thus can be used in the chip level high density packaging.
For 1 + C + 1, a lot of companies can be mass production. 2 + C + 2 little energy to produce, when designing this type of PCB should contact the manufacturer, its production process.
Source: //www.seekic.com
