An electrical test
PCB board in the production process , it is inevitable due to external factors caused by defects on the electrical short circuit, open circuit and leakage, etc. , PCB constantly toward high density, fine pitch , and coupled with the evolution of multi-level , if not timely adverse plate screening out, and let it flow into the manufacturing process , will inevitably lead to more cost- waste, so in addition to improving process control , improved testing techniques also can provide lower scrap rates and improve product yield solutions for PCB manufacturers .
In the production process of electronic products , because the cost of damage caused by defects in various stages has a different degree , the sooner it is found that the lower the cost of remediation .
"TheRuleof10's" is often used to evaluate a PCB remediation costs at different stages of the process is found to be defective when . For example, the empty plate production is completed, if the circuit board can be detected in real time , usually just fill line defects can be improved , or at most the loss of a blank sheet ; however disconnection if not be detected until the board ship to the downstream industry to complete the assembly parts installation, the furnace tin and IR remelting , yet at this time the line has been detected breaker situation , the general assembly of the downstream industry will be to let the empty board manufacturing company seeks compensation for the cost of parts , heavy fees inspection fees. If more unfortunate flaw in the assembly board test industry is still undiscovered , and into the overall system products, such as computers, mobile phones, car parts , then further testing discovered the loss , will be the timely detection of an empty plate a hundred times , a thousand times , or even higher. Therefore , electrical testing for PCB industry is concerned , as is early detection circuit board functional defects .
Downstream industry usually require PCB manufacturers make one hundred percent electrical testing , and therefore with PCB manufacturers on test conditions and test methods agreed specifications , so the two sides will first clear definition on the following matters out :
1 , test data sources and formats
2 , test conditions, such as voltage , current, insulation and connectivity
3 , production methods and the choice of site equipment
4 , chapter tests
5 , repair specifications
