A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCB's can be single sided (one copper layer), double sided (two copper layers) or multi-layer. Conductor on different layers are connected with plated-through holes called vias. Advanced PCB's may contain components - capacitors, resistors or active devices - embedded in the substrate.
Raw material
At the beginning of the 20th century to the late 1940 s, is the infancy of the PCB substrate material industry development. It mainly displays in: the development characteristic of this period with the resin substrate material, reinforced material and insulating substrate, get a preliminary exploration on technology. These are the most typical substrate material for printed circuit board, copper clad with the advent of development, create the necessary conditions. On the other hand, in order to foil etching method (subtraction method) manufacturing circuit PCB manufacturing technology for the mainstream, the initial establishment and development. It is copper clad on the determination of the structure, characteristic, has played a decisive role.
Printed wiring board
Overview
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCB's can be single sided (one copper layer), double sided (two copper layers) or multi-layer. Conductor on different layers are connected with plated-through holes called vias. Advanced PCB's may contain components - capacitors, resistors or active devices - embedded in the substrate.
Function
Electronic equipment adopts the PCB, due to the consistency of the same kind of PCB, so as to avoid the artificial connection error, and can realize automatic instrumentation or SMT electronic components, automatic soldering, automatic detection, ensure the quality of the electronic equipment, improve the labor productivity, reduces the cost, and easy maintenance.
Development
From single to double side, multi-layer PCB and flexible, and their development trend remained. Due to constantly to develop in the direction of high precision, high density and high reliability, shrinking volume, reduce costs, improve performance, makes the PCB in the future development of the electronic equipment engineering, still maintained a strong vitality.
Were reviewed at home and abroad in the future technology development trend of PCB manufacturing is basically consistent, namely to high density, high precision, small aperture, thin wire, small spacing, high reliability, multiple stratification, high-speed transmission, light weight, thin, on the production at the same time to improve productivity, reduce costs, reduce pollution, to adapt to many varieties, small batch production.
Printed circuit technology development level, general with the line width on the PCB, aperture, thickness/diameter ratio
Source
The creator of the printed circuit board is Austrian love, Paul (Paul Eisler), in 1936, he first adopted the printed circuit board on the radio. In 1943, the United States, more people will use the technology in military radio, in 1948, the United States formally ratified the invention can be used for commercial purposes. Since the mid - 1950 - s, printed circuit board began to be widely used.
Before there were PCB interconnection between the electronic components are relying on the wire directly connected. Now, circuit board only made application and test in the laboratory; Printed circuit board in the electronics industry has certainly occupy the position of absolute control.
Classify
According to the circuit layer classification: divided into single panel, double panel and laminated. Common sandwich plate is commonly 4 layer board or 6 layer board, complex sandwich plate can reach dozens of layers.
Characteristic
PCB is can get more and more widely used, because it has many unique advantages, almost Gua as follows.
Can be limited. For decades, with high density PCB can enhance integrated circuit integration and installation technology progress and development.
High reliability. Through a series of inspection, test and aging test can guarantee the PCB (life, generally for 20 years) for a long time and work in a reliable way.
High reliability. Through a series of inspection, test and aging test can guarantee the PCB (life, generally for 20 years) for a long time and work in a reliable way.
Can design. Various performance of PCB (electrical, physical, chemical, machinery, etc.) requirements, can be done by design standardization and normalization of PCB design, time is short, high efficiency.
Can be productive. Adopt modern management, can standardize, production scale (amount), automation and so on, to ensure product quality consistency.
Testability. Established a relatively complete test method, test standard, all kinds of test equipment and instruments to detect and identify PCB products eligibility and service life.
Can be assembled. Convenient for various components for PCB product standardization assembly, and can be automated, large-scale mass production. And at the same time, the PCB components assembly parts can be assembled to form larger parts, system, until the whole machine.
Maintainability. Due to the PCB products and various components assembly components are standardized design and mass production, therefore, these components are standardized. So, once the system failure, can change fast, convenient and flexible manner, quickly restore service system work. Of course, also can for example to get some more. Such as make the system miniaturization, lightweight, high speed signal transmission, etc.
Hard and soft classification
Divided into rigid circuit boards and flexible circuit boards, hard and soft combination plate. Commonly called as shown in the first picture below PCB Rigid (it Rigid) PCB, the second picture the yellow cable in tutu called Flexible PCB (or the one Flexible). Rigid PCB and flexible PCB is intuitively difference between flexible PCB can be bent. The common rigid PCB thickness is 0.2 mm, 0.2 mm, 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.6 mm, 2.0 mm, etc. Common flexible PCB thickness is 0.2 mm, to weld parts will be behind the thickening layer, thickening layer thickness of 0.2 mm, 0.4 mm. Understand the purpose of these is to structure work division to provide them with a spatial reference in design. Common rigid PCB material include: phenolic paper laminated sheet, epoxy laminated paper, polyester glass mat laminate, epoxy glass cloth laminated sheet; common flexible PCB material include: polyester film, polyimide film, fluorinated ethylene-propylene film.
Raw material
Copper-clad laminate is making PCB substrate material. It is used as the support of various components, and can realize the electrical connection or electrical insulation between them.
Aluminum PCB
PCB aluminum plate (metal radiator panels containing aluminum plate, copper substrate, iron base board) is low alloying Al - Mg alloy plate - Si high plasticity (see below) structure, it has a good thermal conductivity, electrical insulation performance and machining performance, now the mainstream aluminum plate Slater.
Contact processing
The green paint covered the most of the welding line copper surface, only show for welding parts, electrical testing and circuit board or move terminal contact. Appropriate protective layer will be added to the endpoint to avoid connecting the anode (+) in the long-term use of endpoint to produce oxide, influence the stability and security concerns.
Molding
Circuit board to CNC machine (or mould punch) cut into the shapes of customer needs size. Cutting through the previously drilled with insteae positioning hole will circuit board is fixed in the bed forming machine (or die). Cutting late finger position and then to grind bevel processing used for circuit board plug. For more joint forming the circuit board for the extra X to break the line (called a V - Cut), facilitate the client after the plug-in split apart. Finally, the dust on the circuit board and ionic contaminants on the surface of the wash.
Final inspection package
In front of the packaging to the electrical circuit board conduction, the impedance test and solder resistance, thermal shock resistance test. And to a moderate amount of baking to eliminate moisture of PCB in the process of adsorption and accumulation of the thermal stress, final reoccupy vacuum packaged for shipment.
Making
Electronic enthusiasts PCB thermal transfer method, the main production methods of photosensitive wet membrane, photosensitive dry membrane method. Etching agent have environmental ferric chloride (FeCl3), have fast hydrochloric acid + hydrogen peroxide (HCl + H2O2).
Commonly used PCB drawing software such as Protel99se Protel software series. Photosensitive dry film + ferric chloride is the best choice for amateurs.
Image
Made the first step is to create online wiring between components. We use the negative transfer (Subtractive transfer) mode will work film performance on the metal conductor. This technique is the entire surface is covered with a thin layer of copper foil, and put the spare part to eliminate. Additional type transfer (i.e. the Pattern transfer) is another less people use way, it is only where the need to apply the method of copper wire, but we are not here to talk about.
If is made of double panel, will be spread on both sides of the PCB substrate, copper foil, if the production is a multilayer, the next step will be to the board to stick together.
Positive photoresist, photoresist) is made of sensitizer, it will dissolve under illumination (negative photoresist is if without lighting will decomposition). There are many ways to deal with the photoresist on the surface of the copper, but the most common way, it is heated, and contains the photoresist on the surface of the rolling (called dry film photoresist). It can also use liquid spray at the top, but dry film type provides high resolution, can also create more fine wires.
Hood is just a manufacturing PCB layer in the template. On the PCB board before the photoresist through UV light exposure, hood can prevent part of the cover in the above areas of the photoresist exposure not (assuming that USES the positive photoresist). These are covered with the photoresist, would be "wiring".
After the photoresist is developed, to etch the other bare copper parts. Board can be dipped into the etching solvent etching process, or spray the solvent on the board. Commonly used as a solvent etching, Ferric Chloride, Ferric Chloride), Alkaline Ammonia (Alkaline Ammonia), Sulfuric Acid and Hydrogen Peroxide, Sulfuric Acid + Hydrogen Peroxide), and copper Chloride (Cupric Chloride) by oxidation reaction such as its oxidation (such as Cu fecl2 fecl3 = CuCl2 + 2 + 2). After the etching will be to get rid of the rest of the photoresist. This is called to take off the membrane (Stripping) program.
Drilling and electroplating
If production is a Multilayer PCB, and containing buried hole or blind hole, each layer board must be bored with first plating before bonding. If you don't pass this step, then can't connect each other.
After by machine equipment according to the requirements of drilling borehole Kong Bi inside must go Through electroplating (Plated Through Hole technology, Plated - Through - Hole technology, PTH). After Kong Bi internal make metal processing, can make the internal lines of each layer can be connected to each other. Before starting the electroplating, must first clear hole of sundry. This is because the resin epoxy compound after heating will produce some chemical change, and it can cover internal PCB layer, so need to clear out. Remove and electroplating movements will be completed in the chemical process.
Multilayer PCB pressing
Each single layer must be pressing to make sandwich plate. Pressing action including adding insulation between the layers, and fastened to each other. If there is through several layers of guide hole, then each layer must be repeated. A multilayer wiring on the outside of the two sides, is often only after a multilayer pressing processing.
Treatment resistance welding layer, surface screen printing and gold finger plating. Next resistance welding paint coverage on the outermost wiring, so the wiring will not come into contact with the outside plating parts. Screen printing surface is printed on it, to mark the location of the various parts, it will not be able to cover at any wiring or gold finger, otherwise may reduce solderability or the stability of the current connection. Gold finger parts usually gold plating, which, when inserted into the expansion slot to ensure high quality of the current connection.
Test
To test whether there is a short circuit or open circuit PCB, can use optical or electronic means testing. Optical methods using scanning to find out the defects of each layer, electronic testing is usually with fly needle detector (Flying Probe) to check all the connections. Electronic testing in search of short circuit or open circuit is precise, but the optical test can more easily detected incorrect gaps between the conductors.
Installation and welding of parts
The last step is the installation and welding the parts. Both THT and SMT parts use of machinery and equipment to install is placed on the PCB.
THT parts are usually called the Wave Soldering (Wave Soldering) way of welding. This allows all parts to a welding on the PCB. First to pin cut close to the board, and slightly bent so that parts can be fixed. Then the PCB will be moved to the cosolvent on the waves of make contact to help at the bottom of the solvent, it can be on the base metal of the oxide to get rid of. After the heated PCB, the move to the melting of solder, at the bottom and contact after welding is completed.
Automatic welding of SMT parts way is called to flow back to welding (Over Reflow Soldering). Contains cosolvent and solder paste in welding, the parts installed on the PCB after the first treatment time, was a PCB again after heating treatment. For PCB cooling after welding is completed, the next is to prepare the final test of PCB.
Proofing
PCB's Chinese name is called printed circuit board, also known as printed circuit boards, printed circuit board is an important electronic components is electronic components support body? The provider of the electrical connection in the electronic components. Because it is made of so called electronic printing "printed circuit board.
PCB proofing is refers to the pilot production of printed circuit board before mass production is mainly used for electronic engineers in the design of circuit? And complete the PCB Layout to the factory after small batch trial-produce process is the PCB proofing. And PCB proofing production quantity generally no specific boundary is an engineer in product design has been finished to confirm and complete the test before we call it PCB proofing. Shenzhen jie state is specialized is engaged in PCB factory proofing and small batch production.
Component Placement
Cloth of PCB board in the process, the system layout is completed, to review PCB figure, look at the layout of the system is reasonable, whether can achieve the optimal effect. Usually can be examined from the following several aspects:
1. The system whether guarantee reasonable wiring or optimal layout, wiring whether can guarantee the reliable and can ensure the reliable of circuit. When the layout of the need of the signal and the direction of the power and ground network have a whole understanding and planning.
2. The PCB size is consistent with the processing drawing size, can meet the requirements of PCB manufacturing process, any behavior. Don't pay attention to this need, a lot of PCB circuit layout and wiring design beautifully, reasonable, but neglect the precise localization of locating connectors, lead to can't and other circuit docking design.
3. Components in 2 d and 3 d space without conflict. Pay attention to the actual size devices, especially the height of the device. Yuan device, layout of the welding from altitude generally no more than 3 mm.
4. The component layout density and orderly, neat rows, whether all the cloth. When components layout, not only to consider the direction of the signal and the signal types, need to pay attention to the places or protect, also want to consider the overall density of the device layout, density uniformity.
5. Often need to change the components can be easily replaced, whether it's a good card inserted into the device. Often should guarantee the change of components of the replacement and plug is convenient and reliable.
6. Pay special attention to when the layout of the radio frequency part, should avoid to radio frequency interference of other components, so must be isolated.
Design
Whether the design of the single panel, double panel, sandwich plate, before is done with protel design, existing PADS, Allegro etc design.
Printed circuit board design based on the graph is based on circuit principle, realize the function of the circuit designer need. The design of the printed circuit board mainly refers to the layout design, need to consider the layout of the external connections, the optimization of the internal electronic components, metal wire layout optimization and hole layout, a variety of factors such as electromagnetic protection, heat dissipation. Good landscape design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be implemented by hand and complex layout design be achieved with the aid of computer aided design (CAD).
1 overview
The purpose of this document is to use the PADS PCB design software PowerPCB PCB design process and some matters needing attention, to provide a working group of designers design specifications, convenient in communication between designer and check each other.
2 the design process
PCB design process can be divided into network layout table input, rule set, components, wiring, inspection, review, output six steps.
2.1 net table input
Netlist input there are two ways, one is the use of PowerLogic OLE PowerPCB Connection function, select the Send Netlist, application OLE function, can always maintain the same principle diagram and PCB diagram, minimize the possibility of error. Another method is to directly load netlist in PowerPCB, select File - > Import, the schematic diagram to generate netlist input in.
2.2 rule set
If in the schematic design stage is the PCB design rules set up fine, don't have to set the rules, because enter table, table design rule has been net input into PowerPCB. If changed the design rules, must synchronize principle diagram, ensure consistent principle diagram and PCB. In addition to the design rules and layer definition, you need to set some rules, such as Pad sports, a hole the size of the need to modify the standards. If a designer has built a bonding pad or hole, must add Layer of 25.
Note:
PCB design rules, layer definition, via setting the Default boot file output Settings has been done, CAM, the name for the Default. The STP, netlist input come in later, according to the design of the actual situation of the power network and assigned to the power and the layer formation, and set the other advanced rules. After all the Rules set in PowerLogic, using OLE PowerPCB Connection Rules From PCB function, update the Rules set principle diagram, the Rules of guarantee principle diagram and PCB diagram.
2.3 components layout
After the network table input, all components in the zero point of work area, overlap, the next step of work is to separate the components, in accordance with the rules of some neat, namely components layout. PowerPCB provides two methods, manual and automatic layout layout.
2.3.1 manual layout
1. The tool structure and size of PCB draw the edge (Board Outline).
2. Scatter Components (Disperse Components), the component will be arranged around the edge.
3. The components one by one, move, rotate, on the edge of less than, well organized according to certain rules.
2.3.2 automatic layout
PowerPCB provides automatic layout and local cluster layout, but for most of the design, the effect is not ideal, is not recommended.
2.3.3 matters needing attention
A. layout is the first principle of guarantee the completion rate of wiring, attention to fly line connection when mobile device, the device together with attachment relation
B. digital devices and emulators thing to separate, as far as possible away from
C. VCC decoupling capacitor close to the device
D. after placing components to consider when welding, don't be too dense
E. use software provides more Array and the Union function, improve the efficiency of the layout
2.4 wiring
Also there are two kinds of wiring way, manual wiring and cabling automatically. PowerPCB provide manual wiring is very powerful, including automatic push, online design rule check (DRC), automatic wiring by Specctra wiring engines, these two methods usually used, the used steps is manual, automatic, manual.
Against 2.4.1 manual wiring
Before 1. Automatic wiring, with manual cloth first some important network, such as the high frequency clock, main power supply and so on, these networks tend to go line distance, line width, line spacing, shielding, etc have special requirements; Other special packaging, such as BGA,
It's automatic wiring cloth have rules, also want to use the manual wiring.
2. After the automatic wiring, even with the manual wiring for PCB go line to adjust.
The automatic wiring 2.4.2
After the manual wiring, the rest of the network to the automatic wiring from the cloth. Select Tools - > SPECCTRA, start SPECCTRA wiring device interface, set the DO file, press the Continue SPECCTRA wiring started the automatic wiring, if after the completion rate of 100%, you can manually adjust the wiring; If less than 100%, the layout or manual wiring has a problem, need to adjust the layout or the manual wiring, until full completion.
2.4.3 matters needing attention
A. the power cord and ground bold as much as possible
B. directly connected to VCC decoupling capacitor as far as possible
C. set Specctra DO file, the first to add Protect all wires command, Protect manual cloth line from the automatic wiring esteem cloth
D. if there is a mixed power supply layer, the layer should be defined as the Split/mixed Plane, before wiring segmentation, after cloth line, using Pour Manager parts relate Connect copper clad
E. set all device Pins to thermal bonding pad, would Filter is set to Pins, selects all objects on the pin,
Modify properties, box in front of the Thermal option
F. manual wiring opened the DRC option to use the Dynamic wiring (Dynamic Route)
Before 1. Automatic wiring, with manual cloth first some important network, such as the high frequency clock, main power supply and so on, these networks tend to go line distance, line width, line spacing, shielding, etc have special requirements; Other special packaging, such as BGA,
It's automatic wiring cloth have rules, also want to use the manual wiring.
2.5 check
Check project have spacing (Clearance), Connectivity (Connectivity), high-speed rules (High Speed) and power layer (Plane), these projects can choose the Tools - > Verify the Design. If set up the rules, you have to check, otherwise you can skip this one. Check out the error, have to modify the layout and wiring.
Note:
Some mistakes can be ignored, such as some part of the connector of the Outline on the plate and frame, check spacing make mistakes; And every time after modified line and hole, copper clad again once.
2.6 review
Review according to "PCB inspection table", the content including design rules, layer definition, line width, spacing, welding plate, via Settings; Also focus on review the rationality of the device layout, power supply, ground network line, high speed clock network with line and shielding, decoupling capacitor placement and connection, etc. Review is unqualified, the designer to modify the layout and wiring, qualified after review and sign respectively.
2.7 the design output
PCB design can be output to the printer or the output light painting file. Printers can put the PCB layers, is advantageous for the designers and the reviewer check; Light painting file to the system board manufacturers, the production of PCB. The output of the light painting file is very important, relates to the success or failure of the design, the following will highlight the cautions of output light painting files.
A. need to output a wiring layer (including top, bottom, middle layer) layout, power source layer (including the VCC layer &gnd), silk screen layer (including the top screen printing, screen printing) bottom, resistance welding layer (including the top resistance and bottom resistance welding) welding, also generate drilling files (NC Drill)
B. if power layer is set to the Split/Mixed, then Add in the Document window of Document Routing choice, and each output light painting files before, all want to use Pour on PCB figure Manager Plane copper clad Connect; If the Plane is set to the CAM, the Plane choice, at the time of item set Layer, to add Layer25, choose Pads and Vias in Layer25 Layer
C. in the Device Settings window (press Device Setup), the Aperture to change the value of 199
D. in setting up each Layer of the Layer, the Board Outline
E. Settings screen printing Layer Layer, don't choose Part Type, select the top (bottom) and the Outline, Text, screen printing Line
F. setting resistance welding Layer Layer, select a hole without resistance welding holes said, don't choose via said resistance welding, determined according to specific situation
G. generated drilling file, use the default of PowerPCB, don't make any changes
H. all light painting after the file output, using CAM350 open and print, by the designers and review according to "PCB checklist" to check.
The industrial chain
Sort them out according to industry chain upstream and downstream, can be divided into raw materials - copper clad - printed circuit board - electronics applications, the relationship between simple expressed as: glass fiber cloth, glass fiber cloth is one of the raw materials of copper clad, composed of glass fiber yarn spinning and weaving, accounts for about 40% of the cost sheet (plate) and 25% (sheet). Raw materials such as glass fiber yarn by silica sand in the kiln calcine into liquid, through tiny alloy nozzle to form very fine glass fiber, and hundreds of root fiberglass foul into glass fiber yarn. Kiln construction investment is huge, generally need to hundreds of millions of money, and once the ignition must 24 hours non-stop production, enter exit cost. Glass fiber cloth manufacturing and weaving enterprise is similar, can be controlled by controlling the speed and quality capacity, and specification is unitary and stable, since the second world war almost no too big changes on the specification. And CCL is different, the price of the glass fiber cloth is affected by supply and demand, the largest in recent years the price fluctuates between $0.50 and $1.00 / m. The capacity of Taiwan and mainland China account for about 70% of the world.
Copper foil, copper foil is the largest proportion of the cost of sheet materials, accounts for about 30% of the cost sheet (plate) and 50% (sheet), so the increase in the price of the copper foil sheet is the main driving force. The price of copper foil closely reflect changes in the price of copper, but weak bargaining power, nearly as copper prices are rising, struggling copper foil manufacturers, many companies were forced to close or takeover, even if the copper clad vendors accept copper foil prices copper foil manufacturers are still common. Because of the price gap, in the first quarter of 2006 is very likely to be a wave of price increases, which could drive the CCL prices.
Copper clad: copper clad in epoxy resin glass fiber cloth and copper foil for fusion agent such as a product of the pressure together, is the PCB raw material directly, after etching, plating, a multilayer pressing to make printed circuit boards. Copper clad industry capital demand is not high, is about 3000-40 million yuan, and can be shut or halt production at any time. In the upstream and downstream industry chain structure, CCL's strongest bargaining power, can not only in the purchase of raw materials such as glass fiber cloth and copper foil with a strong voice, and as long as the downstream demand, can will cost upward pressure on the downstream PCB manufacturer. In the third quarter, copper clad start raising prices, increase in 5-8%, the main driving force is to reflect the increase in the price of copper foil, and downstream demand can absorb CCL manufacturers on price pressures. The world's second largest copper clad manufacturer in South Asia in 2006 on December 15, raise the price of the product, shows that at least in the first quarter of 2006 PCB requirements in good form.
The international situation
Global PCB industry output value of more than a quarter of the total output value of the electronics industry, is the largest proportion in the various electronic components industry segment industry, industry scale of $40 billion. At the same time, due to its unique position in the basis of electronic industry, has become a modern electronic components industry, one of the most active industry in 2003 and 2004, global PCB production value is $34.4 billion and $40.1 billion respectively, year-on-year growth rate of 5.27% and 16.47% respectively. Domestic PCB industry development.
PCB development work in China began in 1956 and 1963-1978, gradually expand the formation of PCB industry. After the reform and opening up more than 20 years, due to the introduction of foreign advanced technology and equipment, single panel, double panel and laminated obtained fast development, the domestic PCB industry gradually developed from small to large. China due to the downstream industry of intensive land and labor costs are relatively low, become the most robust development momentum. In 2002, become the third largest PCB producer. In 2003, PCB production and imports and exports are more than $6 billion, surpassed the United States for the first time, as the world's second largest PCB producer, the proportion of output value by 8.54% in 2000 to 15.30%, increased nearly 1 times. China has replaced Japan in 2006 and become the largest production base of PCB production and technical development of the most active state. PCB industry in China remain around 20% of high-speed growth, much higher than the growth rate of global PCB industry.
From the point of yield components, main products in China's PCB industry has from the single panel, double panel to sandwich plate, and is from 4 to 6 to 6 ~ 8 layers above. With multilayer board, HDI board, flexible plate and the rapid growth of China's PCB industry structure is gradually optimized and improved.
However, while China's PCB industry made great progress, but compared with advanced countries have larger gap, the future still has great improvement and promotion space. First of all, late into the PCB industry in our country, research and development institutions, there is no specific PCB on some new technology research and development ability and foreign manufacturers have a larger gap. Secondly, on the product structure of it, still is given priority to with medium and lower plate production, although the FPC, HDI is growing rapidly, but the base is small, the proportion is still not high. Again, PCB production equipment in our country most dependent on imports, part of the core also can only rely on imported raw materials, industrial chain of incomplete also hindered the development of domestic PCB series enterprises.
Industry overall
As the most widely use electronic components products, the PCB has a strong vitality. No matter from the point of view of supply and demand and judging from the historical period, early in 2006 into the industry is climbing phase, the downstream demand continued strong has been boosted by level of PCB industry chain on shipments of each manufacturer formed at least in the first quarter of 2006 "off-season not light". Industry rating by the "avoid" rise to the "good".
Industry status quo
The benefit from the new products and new market terminal, support, global PCB market successful recovery and growth. Hong Kong circuit board association (HKPCA) data statistics, in 2011 the global PCB market steady development, is expected to rise of 6-9%, while China is expected to grow 9-12%. Taiwan institute (IEK) analysis report predicts that global PCB GDP will grow by 10.36% in 2011, $41.615 billion. According to the analysis of data and Prismark company societe generale securities research center report shows that the PCB change of structure and product structure reflects the trend of the development of industry. Come with single/double panel, sandwich plate decline in output, HDI board, sealing the increase of the load board, soft board output, showed that applied to computer motherboards, communication backplane, car plate in the areas of growth is slower, and applied to high-end mobile phones, laptops and other "lightweight" electronics HDI board, packaging board and soft board will also maintain rapid growth.
The gap with developed countries
China's printed circuit industry after nearly half a century of struggle, is China's electronic information industry has become the indispensable important foundation and the safeguard, the output is in the second place in the world. China's PCB output has reached $2004 in 8.15 billion, import and export amounted to $8.9 billion. Is not a long time will rise as the world's first.
Our country is a major power electronic circuits, PCB production, and now is far from the production of power, China also has the very big disparity compared with developed countries PCB industries.
Environmental protection
In earlier years, circuit board belongs to high-tech industries, most foreign companies control technology output, once bound and limit the development of PCB industry. According to Time magazine reported that China and India is one of the world's most polluted countries. To protect the environment, the Chinese government has to develop and implement strict about pollution treatment method, and spread to the PCB industry. Many towns are no longer allowed to expand and build new PCB factory, such as: shenzhen customs a little and give priority to with high precision manual, such as nanshan Ma Gulong industrial zone of shenzhen jing state science and technology co., LTD., commissioner of is given priority to with batch production equipment. And dongguan have specifically designated four towns as "pollution industry production base," prohibited outside the designated area to build the new factory. But now our PCB enterprise's development is limited by the place, the greater the more developed economy where the restrictions, why?
Because unknowingly, PCB enterprise development has become the government in the eyes of a large, large energy consumption, heavy pollution! In today's attaches great importance to environmental protection and sustainable development, once put on such a "hat", circuit board companies really want to be "shout". In fact, we are large polluters, large energy consumption, water conservation? Of course not! Our PCB enterprise is of low energy consumption and low pollution. We can according to the following data to contrast: from the perspective of environmental protection, through the industry enterprise effluent pollution index to compare, you can see:
Environmental protection
In earlier years, circuit board belongs to high-tech industries, most foreign companies control technology output, once bound and limit the development of PCB industry. According to Time magazine reported that China and India is one of the world's most polluted countries. To protect the environment, the Chinese government has to develop and implement strict about pollution treatment method, and spread to the PCB industry.
Many towns are no longer allowed to expand and build new PCB factory, such as: shenzhen customs a little and give priority to with high precision manual, such as nanshan Ma Gulong industrial zone of shenzhen jing state science and technology co., LTD., commissioner of is given priority to with batch production equipment. And dongguan have specifically designated four towns as "pollution industry production base," prohibited outside the designated area to build the new factory. But now our PCB enterprise's development is limited by the place, the greater the more developed economy where the restrictions, why? Because unknowingly, PCB enterprise development has become the government in the eyes of a large, large energy consumption, heavy pollution! In today's attaches great importance to environmental protection and sustainable development, once put on such a "hat", circuit board companies really want to be "shout". In fact, we are large polluters, large energy consumption, water conservation? Of course not! Our PCB enterprise is of low energy consumption and low pollution.
About PCBway
Since 2003 PCBWAY has been the leading PCB quick turn manufacturer specializing in both Prototype and Production quantities, Initially produced single-sided and double-sided printed circuit boards for the consumer electronics market. PCBWAY is ranked among the top 4 board fabricators in asia and is well-known for its expedited turn time capabilities and its reliable best on-time shipping record.
Today, we have over 450 operators with high modern facilities to manufacture multi-layer PCB up to 12 layers. Backing up with a group of professional engineers, and well established quality system. EVERGREEN has grown to become a major PCB manufacturer in Asia to serve in diverse customers base such as electronics appliance, communication, educational electronics, power supplies, Automationsetc.
Our mission is to become one of leading PCB manufacturer that provide in high quality product with total customer satisfaction.
For more information about PCB, or to learn more about the online quote and ordering process, please visit //www.PCBway.com.
