Intensive assembly board wire (WireBond) prevailed , becoming increasingly important gold-plated nickel , nickel bromide pillar will rise , technology and quality difficulty deepened. Yield big row board size sheet instability , electroplating copper mining level of automation will increase the cost. Holes surge, the aspect ratio (AspeetRatio) increase, the level of anti- pulse rise and vertical anti- pulse power supply. Blind self-propelled vertical copper places vortex mixing method is appropriate, such as UCON.
Thin production difficulties , the characteristic impedance day Yan , Qi straight edge on -line degree requirements becoming harsh . Coping strategies , such as : the use of thin copper , parallel light exposure , a thin wet film photoresist , some etching (PartialEtching), or belt thinning method for mass production . Microporous appear (6mil less ) , increasing layer method (BuildUpProcess) rise , four kinds of non- machine drilled holes into the way ( laser hole burning , plasma bite holes into the hole sensitive chemical pits ) , technology and open CO2 laser method is the most promising , RCC adhesive foil amount of Japanese industry has been rapidly increasing .
Computer speed, the characteristic impedance (CharacteristicImpedance) has become necessary for PCB circuit board layer structure with strict quality requirements of day , " O / S clearance or gap less than 20 %" may allow the concept has been received incorrectly . Thin quality and the alignment of the MLB big row board is the most urgent need of technology, how to enhance the yield will become profitable magic. Wide use of plug hole filling date , such as masking plug hole , filling holes and other resin production technology to be strengthened . Line -intensive electrical test difficulty , a variety of non -contact test method under development . Repeatedly soldering soldering still very hungry , nickel and palladium , silver and other chemicals will replace ENIG , inner part of the plate blackening method to low organic micro- pitting .
