We successfully develop heatsink paste printing technology with good control of flatness, which are now approved by our end customer of AUTO.
In Oct,2013, We finished mass production and finally got positive feedback from end customer. We are confident that we will have more such orders with bigger volume in 2014.
Heatsink Paste Features and Benefits
--Solves medium heat dissipation or cooling problems
--Very low thermal transfer resistance
--Potentially useful to reduce cost of laminates used
--High flexibility to take up thermal stress
--Excellent electrical characteristics sufficient insulation properties
--Excellent long term stability of required properties
--Much lower process cost compared to standard Cu heatsinks!
--No solder mask required on top of the heatsink (cost, efficiency)
--Solder ball repellent (no solder residues)
--100 % solids (no VOC)
Specification
Layer: 2 Layer
Material: FR4 TG130
Board Thickness: 1.6mm
Surface Treatment: immersion gold / ENIG (Au thickness: min 2u)
Solder Mask: White (Taiyo)
Copper Thickness: 2/2oZ
Min.Line Spacing: 0.13mm
Min Trace Space: 0.13mm
Special technology: Heatsink paste printing (thickness 135-160um)
Heatsink paste material: PETERS HSP 2741
