A plated through-hole whose only purpose is to connect a track on one layer or side of the board through to a track on another layer or side. In a via, there is no intention to insert a component lead...
Shiny Li
Jan 28,2016
2099 views
The solder re-flow process that uses a vaporized solvent as the source for heating the solder beyond its melting point,creating the component-to-board solder joint.
Shiny Li
Jan 28,2016
2097 views
A component handling tool with a small vacuum cup for ease of pick-up and removal during de-soldering.
Shiny Li
Jan 28,2016
1896 views
A hole containing no conductive material nor any other type of reinforcement.
Shiny Li
Jan 28,2016
1987 views
A logotype authorized for placement on a product which has been recognized (accepted) by Underwriters Laboratories, Inc. (UL).
Shiny Li
Jan 28,2016
935 views
A groove or excavation at one edge of a conductor caused by etching.
Shiny Li
Jan 28,2016
2234 views
Fluxless soldering wherein molten solder is vibrated at ultrasonic frequencies while making the joint.
Shiny Li
Jan 28,2016
1836 views
Underwriter’s Laboratories, Inc., a corporation for the purpose of establishing safety standards on types of equipment or components in USA and Canada.
Shiny Li
Jan 28,2016
1510 views
The deformation of a rectangular sheet, panel or printed board, that occurs parallel to a diagonal across its surface in such a way that one of the comers of the sheet is not in the plane formed by th...
Shiny Li
Jan 28,2016
1458 views
Dielectric material with higher glass transition temperature and better thermal stability than epoxy resin, however, more expensive and not in common use.
Shiny Li
Jan 28,2016
1500 views
A signal-carrying circuit composed of conductors and dielectric material with controlled electrical characteristics used for the transmission of high-frequency or narrow-pulse type signals.
Shiny Li
Jan 28,2016
1578 views
The metallic conductive strips that provide connections between components, terminals, etc., on printed circuits.
Shiny Li
Jan 28,2016
1427 views
A soldering defect in which a chip component moves into a vertical position during solidification of the solder so that only one terminal is connected. It is caused by defective re-flow processing.
Shiny Li
Jan 28,2016
1505 views
Also called fabrication hole, pilot hole, or manufacturing hole. These are used as PCB reference points upon which other dimensions are based.
Shiny Li
Jan 28,2016
1749 views
The application of molten solder to a basis metal in order to increase its solderability.
Shiny Li
Jan 28,2016
1421 views
An electrical connection between conductive patterns on opposite sides of an insulating base, e.g. plated through-hole or clinched jumber wire.
Shiny Li
Jan 28,2016
1576 views
A plastic cured or hardened by heating into a permanent shape. Thermosets cannot be re-melted.
Shiny Li
Jan 28,2016
1501 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 6 |
| 2 | Engineer | 1 |
| 3 | Stephen Newport | 1 |
