The portion of a soldering iron that is used for the application of the heat that melts the solder.
Shiny Li
Jan 28,2016
1098 views
The evaluation of a metal to determine its ability to be wetted by solder.
Shiny Li
Jan 28,2016
1284 views
The side of a printed board which is opposite to the component side.
Shiny Li
Jan 28,2016
1893 views
An ink, lacquer, photo-resist or metal coating which is not wetted by molten solder. It is applied to specific areas of a PCB to stop them from being solder-coated, usually when mass soldering.
Shiny Li
Jan 28,2016
1225 views
An undesirable protrusion of solder from a solidified solder joint or coating.
Shiny Li
Jan 28,2016
1915 views
Finely divided particles of solder, with additives to promote wetting and to control viscosity, tackiness, drying rate, etc.
Shiny Li
Jan 28,2016
1195 views
Liquid formulations that are used in intermix wave soldering and as coverings on static and wave soldering pots in order to eliminate dross and to reduce surface tension during the soldering process.
Shiny Li
Jan 28,2016
993 views
Coating with mask and insulate areas of a circuit pattern where solder is not desired.
Shiny Li
Jan 28,2016
1948 views
A screening defect characterized by prints having jagged edges, the result of incorrect moving pressure.
Shiny Li
Jan 28,2016
910 views
The process of immersing printed circuit boards into hot liquids. Often referred to as HASL or HAL (Hot Air Levelling).
Shiny Li
Jan 28,2016
944 views
A preferable concave surface of solder that is at the interconnection of the metal surfaces of a solder connection.
Shiny Li
Jan 28,2016
1162 views
A small hole that penetrates from the surface of a solder connection to a void of indeterminate size within the solder connection (process indicator).
Shiny Li
Jan 28,2016
1066 views
The unwanted formation of a conductive path of solder between conductors.
Shiny Li
Jan 28,2016
920 views
A metal alloy with a melting temperature that is below 450℃.
Shiny Li
Jan 28,2016
860 views
The period after pre-heat and before re-flow peak temperature where the internal temperature differences between parts allowed to equalize.
Shiny Li
Jan 28,2016
1035 views
The return of a stencil to normal level after deflection by the pressure of the squeegee moving across the surface.
Shiny Li
Jan 28,2016
1346 views
The space between the top surface of the substrate and the underside of the stencil when the squeegee is not in play.
Shiny Li
Jan 28,2016
1205 views
Surface Mount Technology. Defines the entire body of processes and components which create printed circuit assemblies without components with leads that pierce the board.
Shiny Li
Jan 28,2016
910 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | _ Floppy Lab | 4 |
| 2 | PCBWay Team | 3 |
