As it shows, there are two isolated areas of the ground pour. I'm using Eagle, so when I do the pour it does not place in these type of areas unless I explicitly place a via where the bottom ground pour can reach it.
Are there any reasons to/not to do this? I figure for larger unconnected areas it should be done, but for all the small gaps it can probably be avoided. In particular this is a board for an RF project， would this come into consideration at all?
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