Growing in the electronics industry today , as electronic products to the light, thin , short trend , high-performance and multi-functional electronic device development and improvement of welding technology , flexible circuit board (FPC) is also used as an electronic interaction even the circuit board has been developing rapidly, due to the electronics of the light, thin , short of the demand , the scope of application of flexible printed circuit boards and more widely, flexible printed boards and other in the past two years in China PCB industry type PCB compared to a lot in a small space for wiring , requires repeated bending the selection of a site of special material, so a longer flex life compared to other cables.
Since the light of the characteristics of the flexible plate in the process of selection of the surface treatment equipment and processing methods has its special requirements, production , flexible plate surface cleaning process is a critical link, since it requires not only the surface good condition , while the dimensional stability of the plate , there are strict requirements, depending on the dimensional stability of the dimensional change rate nip foil layer , and also has a great influence in the production process of mechanical grinding, the grinding operation of the brush roller and the board transfer direction in the opposite direction , the effect is to ensure uniformity of polishing , the flexible substrate thin and soft sheet , the grinding pressure is too great tension will be large and the substrate is elongated or break , which is an important cause of the dimensional change of the grinding should be avoided during substrate scratches, tears and card board, if the device is not a professional production conditions in soft board recommended pallet , so to avoid the machine drive wheel spacing, high-pressure washing of red rinse and hot air drying impact of the base card board deformation, or even scrapped .
The flexible plate production process and require a relatively grinding wheel abrasive brush according to the process used in the production of flexible printed circuit board and chemical cleaning method is a nylon brush roller pattern transfer needle hole and the metal surface of the step affixed to the cover film ideal for handling, both to remove the copper surface oxide layer board can do a good roughness.
When Immersion gold surface pre-treatment process , choose low cutting force non-woven brush roll , because of its uniform fine grinding effect , to ensure removal of board adhesive residue on the pad evenly careful polishing process , which is nylon pin brush can not reach the surface treatment effect , because of the soft boards are generally smaller and less pad , ordinary nylon brush pin to the pad can not be completely milled , and will leave scratches strip grinding , welding and surface impact beautiful. Choose soft and low cutting forces than conventional non-woven nylon brush roller can improve needle brush can not be achieved , because of its non-woven brush roll evenly fine grinding effect is the production of many high-precision circuit board manufacturers preferred , it is recommended to use the brush roller surface hardness of 30-45 degrees +1200 1000 # # red roller brush with the use of non-woven , grinding marks controlled 8-10mm, can ensure the pad to remove dirt , surface coating smoothness.
Flexible plate metal hole before cleaning the surface to be polished , so as to improve the cohesive force of the porous metal coating and the substrate , while the hole of the metal surface of copper pattern imaging before effective treatment , the copper foil and for enhancing the anti- etching layer adhesive strength is also very important , the first plate hole FPC clean, untreated metal surface , the hole may be a metallization layer delamination , blistering , before forming the image on the roughened copper surface is not clean , and the resist layer the combined force is not enough , in the plating process behind the production of fine lines prone to diffusion coating graphics , short circuit defects , resulting panels scrapped.
CCL holes on the surface of metal grinding and pattern transfer before roughening methods recommended alumina abrasive containing 800 # +1200 # nylon brush roll pin , not only can effectively remove copper particles , and is able to effectively rough copper surface effect , Scar controlled 8-12mm, can effectively prevent the coil and grinding cause the board to be stretched over issues such as nylon yarn needle containing alumina abrasive in dealing with the copper surface , cutting intensity smaller than conventional silicon carbide abrasive , reduce board surface scratches, the more dense the finer scratches , resist layer board with binding force , the better , in the back of the resist paste the cover we recommend using wet film, in order to strengthen the board with more adhesion of the resist layer.
Chemical cleaning method is used to remove the organic chemical surface debris and organic contaminants and micro -etching solution for the surface roughening treatment , the treated surface after the copper has good flatness , but there is no mechanical scratches and residual abrasive particles , fine line printed circuit board is therefore ideal for cleaning processing surface roughening treatment method, but difficult to complete the copper particles and foreign matter during leveling remove the copper foil surface of this method , is easily oxidized , rough no good effect of the mechanical polishing , adapted to cover the front cover film onto the treatment process .
