1, Additive Process plus method
Means a non-conductive substrate surface , with the assistance of additional blocking agent to the electroless copper layer is grown directly process a partial conductor lines ( see board information magazine 47 P.62). circuit boards used in different ways plus method can be divided into full bonus, semi-additive and some bonus and so on.
2, Backpanels, Backplanes support plate
A thicker ( such as 0.093 " , 0.125" ) circuit boards specifically to plug contact other board. Its approach is to insert multiple pin connector (Connector) through holes in tight , but not solder, and connector on each guide pin through the board , then each wire winding way . But also be inserted into the connector board in general . Because of this particular board, it can not solder through-hole , but let guide pin hole wall and the use of direct clamping , so the quality and aperture requirements are particularly stringent , the orders are not a lot of general circuit board are reluctant to this is not easy to take orders in the United States has almost become a high- grade specialized industries.
3, Build Up Process additional layer of legal process
This is a new approach multilayer thin areas , the first is derived from IBM 's SLC enlightenment process , the Department of its factories in Japan Yasu started trial production in 1989 , the law is based on the traditional double-sided , since the two outside board first comprehensive coating liquid photosensitive precursors such as Probmer 52, after the semi-hardened and photographic resolution , make communicating with the bottom of a shallow shape the next "photosensitive pilot hole " (Photo-Via), then the chemical copper and the overall increase in copper plating conductor layer , and after imaging and etching lines , buried or blind holes get new leads and the underlying interconnect . So again adding layers will achieve the desired number of layers of plywood . This method not only can avoid costly mechanical drilling costs, and the pore size can be reduced to more 10mil less. Over the past five to six years, all kinds of techniques to break the traditional shift to successive additional layer of plywood , under the United States , Japan and Europe continue to promote the industry , making these Build Up Process fame , has more than ten products listed Zheyi species. In addition to these "photosensitive into the hole " outside ; holes after removing copper still , for basic organic chemicals bite plate hole , hole burning laser (Laser Ablation), and plasma etching holes (Plasma Etching) different . " into the hole " means. But also to the other semi-hardened resin coated adopted new " adhesive foil " (Resin Coated Copper Foil), the use of successive lamination methods (Sequential Lamination) made finer and more dense small and thin plywood . Variety of personal electronic products in the future , this will become a real slim and light plywood world.
4, Cermet Tao Jin
The ceramic powder is mixed with the metal powder , and then added as a bonding agent for coating colors , printing can be thick or thin film , and as a " resistor " the cloth placed on the circuit board ( or the inner layer ) to instead of the external resistor assembly.
5, Co-Firing of firing
A ceramic hybrid circuit board (Hybrid) is a process , the small plate surface has a variety of precious metal thick film printing paste (Thick Film Paste) line , placed in high-temperature firing . The thick film paste of organic carrier is burned , leaving the noble metal conductor lines to act as interconnection conductors.
6, Crossover more pay, take delivery
Interchange of the two wires aspect board is filled with a dielectric gap between those termed intersection. Generally single-panel green paint surface plus carbon jumpers, or on the following additional wiring layer method are these " more pay ."
7, Discreate Wiring Board discrete wire circuit boards, double-track board
That is another argument Multi-Wiring Board , and is a circular wire attached to the board and add a through-hole formed . Such double-track board performance in terms of high-frequency transmission line , made of flat square etched lines better than the average PCB.
8, DYCOstrate pits increased plasma layer method
Is located in Zurich, Switzerland, the company developed a Dyconex Build up Process. Department of the copper plate surface of each hole at the first ablation , and then placed in a sealed vacuum environment , and filled with CF4, N2, O2, so that ionization in the formation of the active high voltage high plasma (Plasma), for corrosion perforation position of the substrate , and the emergence small pilot hole (10mil or less ) of the patented method , its commercial process called DYCOstrate.
9, Electro-Deposited Photoresist electrodeposition photoresist, photoresist electrophoresis
Is a new kind of "sensitive resist " Construction Law " electrodeposition paint" respect for the shape of the original complex metal objects , recently introduced to " resist " applications. Department of Mining Plating charged resin sense of rotation will be charged colloidal particles uniformly coated on the surface of the circuit board copper , as an anti- etch resist . Now including copper etching process laminates direct mass use . Such ED photoresist according to the different methods of operation , can be placed in the anode or cathode , respectively, construction law , known as the " power of positive type photoresist " and " cathodic electrodeposition resist ." But also according to their different photographic principle of " photopolymer " ( negative work Negative Working) and "sensitive decomposition " ( positive-working Positive Working) and other two types . Current negative- working resist ED has been commercialized , but only as a blocking agent of the plane , the through-hole of the photosensitive image transfer difficulties because it could not be used for the outer plate. As for the outer panels can be used as a photoresist " positive ED" ( case sensitive due to the decomposition of the coating , the pore walls , although less sensitive , but had no effect ) , the current Japanese industry is stepping up its efforts to remain , hoping to expand the commercialization production purposes , the fine line of making relatively easy reach . This term is also known as " electrophoresis resist " (Electrothoretic Photoresist).
10, Flush Conductor embedded line , posted flat type conductors
Is a comprehensive look flat , and all the conductor lines are pressed into the sheet into a special circuit board. The single panel in a semi-hardened practice (Semi Cured) substrate plate with the image transfer method of the first part of the copper foil obtained by etching the plate surface to the line . Then high temperature and pressure line manner pressed into the plate surface of the plate being half- cured , and can complete the work hardening resin sheet, a line is retracted into the entire surface of a flat board form . This board is usually retracted into the line surface, still need to etch away a layer of micro- thin copper layer to another layer of nickel plated 0.3mil, and 20 micro inch layer of rhodium , or 10 microinches of gold layer, when performing the sliding contact, the contact resistance can be lower , and easier to slide. But this method is not appropriate to do cleft PTH, pushed in through holes to prevent racking , and this board to achieve a completely smooth surface is not easy , it can not be used at high temperatures to prevent expansion of the resin surface and then the top of the line come . This technique is also known as Etch and Push method, the completion of the board called Flush-Bonded Board, can be used RotarySwitch and Wiping Contacts and other special purposes.
11, Frit glass frit
In the thick film paste (Poly Thick Film, PTF) printing paste , in addition to precious metal chemicals , but still need to add glass powder category , in order to play the effect of cohesion and adhesion burning at high temperatures melt , making printing paste on a blank ceramic substrate can formation of a solid precious metal circuitry.
12, Fully-Additive Process full build
Is fully insulated sheet surface to electroless deposition of metal Act ( the vast majority of chemical copper ) , the practice of growing a selective circuit , called " full build ." Another kind of not quite correct to say that "Fully Electroless" method.
13, Hybrid Integrated Circuit Hybrid circuit
Is a thin ceramic substrate in a small , precious metals applied to the printing of conductive ink line , and then the temperature of the ink in the organics burn away, while leaving the board conductor lines, and can be soldered surface-mount components . Is a range between the printed circuit board and the semiconductor integrated circuit device , the circuit carrier are thick-film technology . Had earlier used for military purposes or high frequency in recent years because the price is very expensive and diminishing military , and difficult to automate production, coupled with the circuit board under the increasing miniaturization of precision, has made much less than the growth of such Hybrid early .
14, Interposer interconnect conductive material
Means any two insulated conductors carrying the object to be turned on its place be filled by some of the conductive filler and class to conduction who were called Interposer. If the bare plywood hole , if filled with silver paste or ointment instead of copper by orthodox copper hole wall or vertical unidirectional conductive layer and other materials , are such Interposer.
15, Laser Direct Imaging, LDI Laser Direct Imaging
The pressure is already attached to a dry film of the board, is no longer used for image transfer film exposure , while directing the laser beam substituting computers for fast scanning directly on the photosensitive dry film imaging . Since the emitted energy is focused on a single beam of parallel light , it can dry more vertical sidewalls after developing . But law and therefore can only work alone each piece of the board , the production rate is far better than using traditional film and exposure to the quick. LDI can only produce 30 per hour film type area of the board, which can only occur infrequently in the prototype class proofing or high price of the board . Since the cost of congenital remains high, it is difficult to promote in the industry.
16, Laser Maching laser processing method
Electronics industry , there are many sophisticated processing , such as cutting, drilling , welding, welding , etc., can also be used to carry the energy of laser light , that the laser processing method. LASER is the so-called "Light Amplification Stimulated Emission of Radiation" abbreviation mainland industry translated as " laser " for translation , it seems more relevant than the transliteration . Laser in 1959 by the American physicist THMaiman, the use of laser light to produce a single beam of light shines on Ruby , research over the years has created a new way of processing . In addition to the electronics industry , but can still be used for medical and military fields .
17, Micro Wire Board micro- seal line ( Packet Line ) board
Attached on the plate of circular cross-section wire ( rubber seal line ) , by making a special circuit board interconnect layer between PTH completed , the industry known as Multiwire Board " double-track board" when wiring density is very large (160 ~ 250in/in2 ) , and the very small diameter (25mil hereinafter ) who is also known microencapsulation board .
18, Moulded Circuit molded three-dimensional circuit board
The use of three-dimensional molds to injection molding (Injection Moulding) or transformation method to complete the three-dimensional circuit board manufacturing process , called Moulded circuit or Moulded Interconnection Circuit. On the left is a schematic diagram of the MIC shot twice completed .
19, Multiwiring Board (or Discrete Wiring Board) Pipeline panel
Refers to the use of very fine wire, copper plate directly on the surface without a wiring for the interchange , and then by drilling and plating adhesive fixing hole of the multilayer interconnection boards obtained , called " double line board . " This system developed by American PCK company , Nissho Hitachi is currently still in production . Such MWB saving design time , a small number of lines for complex models ( message board section 60 magazine has a special article describes ) .
20, Noble Metal Paste precious metal printing paste
Printing a conductive thick film paste is used for printing . When their method to screen printed on the ceramic substrate , and then to a high temperature organic carrier which burned away, the precious metal appears solid line . Such printing paste, a conductive metal particles added as a noble metal for the job must be to avoid the formation of the oxide at high temperatures . The users of commodities such as gold, platinum , rhodium, palladium and other precious metals or other .
21, Pads Only Board sole plate
Through-hole early age, some plywood to ensure high reliability soldering and wiring safety, especially with only the through-hole solder ring left in the panels, which will interconnect line on the next possession into the inner . Such a two-tier board more classes will not be printed solder mask , special attention to the appearance , quality inspection is very strict . Since the wiring current density, many portable electronic products ( such as mobile cellular phones ) , the circuit board , leaving only a small SMT pad or line density and the number of lines interconnecting the inner layer is embedded between the layers may also shift to difficult for blind holes or " cover blind hole " (Pads On Hole), as a whole through-hole interconnection in order to reduce damage to the ground and the voltage large copper surface , such a dense SMT pad mounting plate also is the only class .
22, Polymer Thick Film (PTF) thick film pastes
Refers to the ceramic thick film circuit board substrate , the precious metal used in the manufacture of printed circuit cream or ointment form printed film printed resistors are concerned , it has a screen printing process and subsequent high-temperature incineration . The organic carrier burn left, appears firmly attached to the wiring system , this board category known as hybrid circuit board (Hybrid Circuits).
23, Semi-Additive Process semi-additive process
Refers to the surface of the insulating substrate , in order to approach the desired chemical copper grown directly out of the first line , and then continue to change the way electricity copper thickening , called " semi-additive " manufacturing process . If all lines are used chemical copper thickness method is called "full plus" process . Note that the above definition is from 1992.7 . Latest specification issued by IPC-T-50E, with the original IPC-T-50D (1988.11) in the text have been different. Early in the "D version " argument with the industry in general , refers to the bare substrate are non-conductive , or already on thin copper foil substrate (Thin foil such as 1/4 oz or 1/8 oz persons ) 's . Ready first image transfer resist the negative , then the chemical copper or copper plating method required the line to be thickened. The new wording does not mention the thin copper 50E , the gap between the two considerable argument , the reader should follow the concept seems to be the era of progress is.
24, Substractive Process Subtractive
Refers to the local substrate surface to remove unwanted copper reduction to reach the circuit board approach is called " subtractive method " is the main circuit board for many years . With another board in the absence of the copper substrate , plus copper conductor for direct line "addition method " is just the opposite .
25, Thick Film Circuit Houmodianlu
After the screen printing method is a noble metal -containing component "thick film paste " (PTF PolymerThick Film Paste), the ceramic base plate (e.g., aluminum oxide ) to print the desired line , and then fired at high temperature ( Firing), makes it a metallic conductor line system , that the " thick film ." Is part of a small " hybrid circuit " board (Hybrid Circuit) is . "Silver Jumper " on the single-sided PCB (Silver Paste Jumper) also belongs thick film printing , but without high-temperature firing . The substrate surface in a variety of printed wiring boards , the thickness must be 0.1 mm [4 mil] or more before called " thick " line , about such " circuitry " production technique is called "thick membrane technology . "
26, Thin Film Technology Thin Film Technology
The attachment means on the substrate and interconnection conductor path plane , where the thickness of 0.1 mm [4 mil] Hereinafter, a vacuum evaporation method can be adopted (Vacuum Evaporation), the coating pyrolysis method (Pyrolytic Coating), cathode sputtering ( Cathodic Sputtering), chemical vapor deposition method (Chemical Vapor Deposition), plating, anodizing, etc. produced by , called " thin-film technology ." Practical product class has Thin Film Hybrid Circuit and Thin Film Integrated Circuit and so on.
27, Transfer Laminatied Circuit turn -pressure line
Is a new circuit board production method, using a 93 mil thick lines treated smooth stainless steel plate negatives dry transfer graphics do first , and then the line of high-speed copper . After stripped dry , can be a stainless steel plate surface lines in high temperature lamination on a semi-hardened film. Then detach the stainless steel plate , you can get the flat surface of the circuit board wiring buried it. Its follow-up can still get bored and plated holes interconnect layers.
