Layer stack-up specifies the PCB proper arrangement of circuit board layers for multilayer boards before starting board layout design. Stack-up mainly defines which layers should be solid power and ground planes, the substrate (dielectric constant), and the spacing between layers. While planning a layer stack-up, also compute the desired trace PCB dimension and minimum trace spacing. Cores are made up of a copper-plated glass-reinforced epoxy laminate PCB sheets.
Stack-up Planning the good PCB multilayer stack-up is the most important factor in determining the EMC performance of a product. A well designed layer stack-up not only minimizes the energy it radiates, but can also make circuit relatively immune from external noise sources. Well stacked PCB substrates can also reduce signal crosstalk and impedance mismatch issues. On the other hand an inferior stack-up can increase the EMI radiation, because reflections and ringing in the system due to impedance mismatch which can dramatically reduce the product performance PCB and reliability.
